As the AI computing race accelerates and semiconductor manufacturing capacity is increasingly redirected toward advanced memory, the memory industry is shifting from price-driven competition to a battle over resource allocation and supply security. The rapid expansion of high-bandwidth memory (HBM) production continues to consume advanced fabrication capacity, constraining the supply of conventional memory products and creating persistent shortages across the market. This concentration of high-end production has widened the supply-demand gap, driving the average selling prices of certain premium memory products to levels eight to ten times higher than previous norms

Rugged edge computing brand – Cincoze will showcase its latest embedded computing solutions at COMPUTEX Taipei 2026, from June 2–5 (Hall 2, Booth Q0401a). Cincoze will display its full range of edge computing solutions around the theme of "Smarter, Faster, More Reliable - Powered by Edge AI" encompassing the full spectrum of edge application environments in four dedicated zones, including DIN-Rail computers, industrial panel PCs and monitors, rugged embedded computers, and GPU embedded computers

Technology news, product launches and show highlights from the event attendees available for download (PDF).

As Artificial Intelligence (AI) applications rapidly expand from cloud computing to edge computing, smart manufacturing, networking equipment, and AI PCs, stable and high-efficiency power supply has become the critical foundation for AI system operations. FSP Group will make a major appearance at COMPUTEX 2026 under the theme "Powering AI Together," showcase to  comprehensively demonstrate its AI power solution layout from data centers to end-user devices.Collaborating with Global ICT LeadersThis year, FSP Group has joined forces with multiple AI and Information and Communications Technology (ICT) leaders to demonstrate application results. Partners include Advantech, AIC, ARBOR, Chenbro, CyberTAN, UNEEC, Intel, SPARKLE, Trust5 intelligence and Uniwill.Through live system demonstrations, FSP will showcase how its power solutions are successfully integrated into AI servers, industrial PCs, and smart devices, further driving the rapid implementation of AI business applications.Focusing on Critical Power Infrastructure in the AI EraThis exhibition showcases FSP's AI power solution portfolio spanning from data centers to end devices, focusing on the critical power infrastructure driving the AI era, including: Data Center Power Shelf, Battery Backup Unit (BBU) Shelf, Networking Power Solutions, CRPS Solutions, Industrial PC (IPC) Power Solutions, USB PD Fast Charging Solutions, Grid Resilience Solutions, AI PC Power Solutions.These exhibits fully demonstrate FSP's comprehensive technical strength from core infrastructure to terminal applications.High-Performance Computing and Edge AI ApplicationsData center solutions focus on AI servers and High-Performance Computing (HPC) applications, providing high-efficiency and reliable power support tailored for high-power, high-density, and redundancy requirements. Meanwhile, networking and edge computing applications cover diverse scenarios including PoE switches, network switches, embedded systems, and edge AI servers, aiming to meet the power demands of various AI architectures."Micro Customization" as a Core Competitive EdgeFSP stated that in the face of rapid AI market development and diversified application needs, the company continues to leverage "Micro Customization" as its core competitive advantage. By providing highly flexible and reliable power solutions tailored to different application scenarios, FSP helps customers shorten development cycles and enhance system stability and market competitiveness.Complete Layout for High-End Consumer and Retail MarketsIn addition, FSP showcased a variety of products tailored for AI workstations. This impressive lineup features high-wattage power supplies such as the CANNON 3300W, the TWINS PRO 1400W ATX(PS2) redundant power supply, the high-power TWINS CRPS 3200W redundant power supply, and the 80 PLUS Titanium-certified MEGA TI 1650W White Edition. On the chassis front, FSP introduced multiple 4U Tower/Rack hybrid AI chassis, alongside the S210 chassis, specifically designed for compact performance and certified with NVIDIA SFF READY.  Providing a complete solution from power supply to chassis cooling, this display fully demonstrates FSP's comprehensive product layout in both enterprise-level applications and high-end consumer markets.With the rapid advancement of AI applications, power supplies have evolved from backstage components to the critical core of system performance and stability. Through COMPUTEX 2026, FSP Group will further demonstrate its technical prowess and industrial layout in the AI power sector.For more information on FSP products, please visit.

iCatch Technology announced PAISB (Physical AI Sensor Bridge) - a HSB-aligned Imaging ASIC designed to enable scalable, time-aligned multi-sensor ingest for Physical AI platforms. At COMPUTEX 2026 (June 2–5), iCatch will showcase its latest PAISB solutions at Booth #R0826, Nangang Exhibition Center Hall 2, 4F.As Physical AI systems rapidly evolve, developers are increasingly challenged by the complexity of multi-sensor synchronization, high-bandwidth data ingest, and image quality tuning, which often diverts resources away from core AI development. iCatch's PAISB platform directly addresses this challenge by introducing a hardware-accelerated, HSB-aligned imaging pipeline that enables deterministic, low-latency data transfer into NVIDIA GPU platforms. By offloading sensor ingest, synchronization, and imaging processing into a dedicated ASIC, PAISB allows developers to focus on AI model innovation and system-level applications, positioning iCatch as a key enabler within the NVIDIA Holoscan ecosystem for next-generation robotics, autonomous systems, and Physical AI deployments.At COMPUTEX 2026, iCatch will demonstrate two key PAISB platforms that highlight this capability. The PAISB-E1 (1GbE) can run stereo vision applications on NVIDIA platforms, designed for smart actuators and dexterous robotic manipulation requiring precise depth perception and real-time responsiveness. In parallel, the PAISB-E10 Proto-ES (10GbE) will showcase Tele/Wide imaging with EIS on NVIDIA platforms, targeting humanoid robot edge platforms and robotic factory simulation server environments. These demonstrations illustrate how PAISB enables time-aligned, high-bandwidth multi-sensor streaming while simplifying system integration."PAISB represents a key milestone in iCatch's Physical AI platform strategy," said Weber Hsu, President of iCatch Technology. "As the first HSB-aligned Imaging ASIC, PAISB enables AI developers to focus on model innovation by abstracting sensor-level complexity. We are committed to building the sensor infrastructure layer that accelerates Physical AI deployment across robotics and autonomous systems."iCatch invites industry partners and developers to visit the booth at COMPUTEX 2026 to experience live PAISB demonstrations and explore collaboration opportunities. Learn more about PAISB and Schedule a meeting or request information.

The perfect fusion of the world’s smallest fan and advanced thermal-optimized SSD technology for AI computing applications.Datotek Inc., a provider of high-performance storage and memory solutions, will showcase its latest AI-driven storage technologies at COMPUTEX 2026 in Taipei. As one of the SSD manufacturers and DRAM manufacturers focusing on AI storage innovation, Datotek will present PCIe Gen5 NVMe SSDs, memory modules, portable SSDs, and advanced SSD heatsink innovations designed for AI computing, edge AI applications, and high-performance systems.The company continues to strengthen the integration between AI technologies and high-speed storage architecture. By combining PCIe Gen5 SSD, NVMe SSD, memory modules, and intelligent thermal management technologies, Datotek aims to deliver faster, smarter, and more intuitive storage experiences for creators, professionals, gamers, and AI users.At COMPUTEX 2026, Datotek will present a wide range of AI storage and high-performance computing solutions, including PCIe Gen5 NVMe SSDs, portable SSD solutions, memory module technologies, and SSD heatsink designs optimized for AI PCs, gaming systems, creator workflows, and edge AI environments.New M.2 2280 PCIe Gen5 SSD Active Cooler: 1cm thin with extreme cooling. Credit: Datotek Inc.One of the key highlights of this year's exhibition is the debut of the "ARES AEROFIN" active SSD Heatsink solution, designed for the extreme thermal demands generated by PCIe Gen5 NVMe SSD platforms and AI-intensive workloads. The advanced cooling system combines an ultra-slim active cooling architecture, Skived Fin high-density fin technology, and a micro cooling fan to effectively reduce thermal throttling, maintain SSD stability, and improve long-term system reliability under sustained high-load operation.With an industry-leading thickness of only 1 cm and a lightweight 20 g design, ARES AEROFIN delivers a compact yet highly efficient SSD cooling solution for high-performance PCs, gaming platforms, AI computing systems, and content creation environments. Designed for AI workloads, 8K video editing, AAA gaming, and professional creator applications, the active heatsink significantly improves thermal efficiency while maintaining stable PCIe Gen5 NVMe SSD performance.Exploded view detailing the cooler module's tech & specs. Credit: Datotek Inc.In addition to performance innovation, Datotek continues to advance intuitive AI storage and portable SSD solutions that simplify data management and improve accessibility. By integrating user-centric design with high-speed storage and memory module technologies, the company aims to accelerate the adoption of AI-powered storage in everyday applications.Under intensive operating conditions, Gen5 NVMe SSD temperatures can rapidly increase and impact system stability. Equipped with the ARES AEROFIN heatsink, SSD peak temperatures can be reduced to as low as 42.6°C and stabilized at approximately 38°C during extended operation. This thermal performance enables PCIe Gen5 NVMe SSDs to sustain ultra-high-speed performance of up to 14,000 MB/s read and 12,000 MB/s write speeds without throttling, helping extend SSD lifespan and supporting more sustainable storage operation.Datotek remains committed to its core philosophy of "Technology Innovation" and "Sustainable Development." In addition to advancing SSD, NVMe, PCIe, memory module, and AI storage technologies, the company continues to promote green supply chain practices, intelligent cooling innovation, and environmentally responsible product development. Moving forward, Datotek will collaborate with global ecosystem partners to accelerate smarter and more sustainable digital transformation in the AI era.Visitors are welcome to explore Datotek's latest AI storage, PCIe Gen5 NVMe SSD, portable SSD, memory module, and advanced SSD heatsink innovations at Booth I1124, Taipei Nangang Exhibition Center, from June 2-5, 2026 during COMPUTEX 2026. For more information, please visit Datotek Official Website and Datotek Facebook Page.