At COMPUTEX 2025, ASUS showcased its comprehensive AI infrastructure solutions, targeting the computing needs of data centers, edge computing, and a wide range of intelligent applications. With a robust product portfolio, ASUS brings to life the NVIDIA AI Factory vision, illustrating how AI will be deeply embedded into enterprise IT infrastructure. This evolution continues to drive forward applications and services that shape the future of AI and high-performance computing

Linxens, a global leader in component-based solutions for authentication and traceability, and Dracula Technologies, a pioneer in ambient light energy harvesting, have announced a strategic collaboration to develop next-generation autonomous IoT solutions for traceability and smart labelling applications. This collaboration paves the way for smarter and more sustainable connected devices

Technology news, product launches and show highlights from the event attendees available for download (PDF).

With the widespread adoption of AIoT (Artificial Intelligence and Internet of Things) applications—from smart home devices to smart manufacturing, connected vehicles, smart cities, infrastructure and defense systems—the reliance of digital devices on flash memory for code storage has rapidly expanded. Memory is no longer just a medium for data storage; it now serves as the carrier for firmware, the repository for AI models, and the guardian of identity and authorization data. Ensuring security of flash memory directly determines the trustworthiness of the devices themselves.Risks from Real World Applications-A smart doorbell was compromised and used for remote surveillance of households by hackers.-A smart camera product line was infected with malware due to poor memory protection, causing large-scale corporate network breaches.-A battlefield drone was hijacked. Investigation revealed its unprotected flash memory exposed flight parameters and credentials.When memory becomes the convergence point for both data and instructions, a single breach can collapse all layers of defense.The Changing Role of Memory in AI SystemsThe introduction of AI, especially in edge devices, has made the role of memory even more critical. Today, memory not only stores data but also holds AI model parameters and behavioral decision logic. The requirements for memory integrity and non-repudiation have increased significantly. If AI models are tampered with, it can lead to erroneous decisions or even malicious behavior.Moreover, AI-driven real-time responses demand that memory supports lower latency and higher confidentiality. Traditional security designs focused solely on data protection can no longer meet the needs of modern devices.The Challenge of Compliance and the Surge of StandardsGlobal regulations around IoT and industrial device cybersecurity are intensifying. The EU's Cyber Resilience Act, the U.S. IoT Cybersecurity Improvement Act, ISO 21434 for automotive systems, and IEC 62443 for industrial control systems all require strong confidentiality and data integrity—even at the memory level. Flash memory must now address both functional safety and cybersecurity challenges.To learn the latest cybersecurity regulations and trends, download the hardware security whitepaper for free.Rethinking Memory Security AssumptionsHistorically, memory was treated as a peripheral component, with security left to the main controller. But today's attackers use physical access tools, firmware injections, and interface-level attacks to exploit memory. Flash memory must now adopt active defense mechanisms, including:- Hardware-level access control- Data encryption and firmware authentication- Event logging and anomaly detection- Logic-level separation and multi-factor verificationRedefining the Role of Secure Flash MemoryTo truly counter next-generation risks, flash memory should integrate secure logic circuits, providing secure boot, firmware authentication, key management, encryption engines, and access control. Such designs greatly reduce the risk of edge devices being compromised, controlled, or having their data stolen.In product design, special emphasis shall be placed on the concept of 'establishing a root of trust' through Secure Boot and key storage mechanisms. This ensures that every device boot starts from trusted code, preventing malicious firmware implants. Key storage shall be implemented in a pure hardware architecture, isolating sensitive information in inaccessible secure zones, significantly enhancing both physical and logical security.For firmware security, compliance to firmware authentication and resilience design standards such as NIST SP 800-193. This means not only verifying firmware integrity at boot, but also automatically recovering to a safe state in the event of an attack or anomaly, ensuring continuous device operation and protection from malicious software.Furthermore, secure storage solutions shall use a pure hardware architecture, requiring no external software or controller assistance, maintaining high security and performance even in harsh environments.To address supply chain security challenges, advanced digital signature technology is needed, ensuring that every firmware and software update from the manufacturer to the end device can be verified for source and integrity, providing comprehensive secure supply chain support.To meet post-quantum threats, advanced encryption standards such as CNSA 2.0 (Commercial National Security Algorithm Suite 2.0) compliance is necessary, ensuring that the software update architecture complies with the latest international cybersecurity regulations and meets the needs of high-security applications in government, defense, and automotive sectors.Winbond W77Q / W77T Secure Solutions and Industry PracticeAs a provider of secure logic circuit flash memory solutions, our products have been successfully adopted across diverse applications, including computer peripherals, video conferencing equipment, servers, AI edge servers, and automotive modules. Our designs maintain logical compatibility with existing market architectures to ensure smooth integration and low migration cost.Our solutions integrate LMS (Leighton-Micali Signature) advanced digital signature technology for PQC (post-quantum cryptography) needs.Our security architecture is also certified under leading global standards including Common Criteria (CC), FIPS 140-3, SESIP, PSA, IEC 62443, ISO 21434, and ISO 26262—offering customers a reliable and future-ready foundation.Safeguarding Human-Centered Trust at the Technological EdgeIn the AIoT era, memory security is no longer just about storage—it is the foundation of system-wide trust. From household devices to tactical drones, memory holds more than data; it protects privacy, drives enterprises, and underpins societal resilience.As a Secure Flash Memory solution provider with dedicated logic design, we understand the profound responsibility behind technology. Our solutions offer downward compatibility with mainstream architectures, while meeting stringent global security standards.True innovation is not just about what we can do—but what we can trust. We are committed to embedding security into every smart node and collaborating with partners, developers, and standards bodies to ensure technology continues to serve human values.To learn more about Winbond's advanced security solutions, visit Winbond's website or contact Winbond directly, or download the latest Hardware Security White Paper.

xMEMS Labs, the global leader in solid-state MEMS speakers and micro-scale thermal solutions, today announced the return of its highly anticipated xMEMS Live Asia seminar series, taking place September 16 in Taipei and September 18 in Shenzhen.Now in its third year, xMEMS Live Asia brings together engineers, product designers, system architects and company executives to explore how MEMS-based audio and active thermal management technologies are redefining the design and performance of next-generation AI interface devices – from AI glasses, smartphones, headphones and earbuds to SSDs, optical transceivers and rack servers in the data center.This year's one-day seminars will center on live product demonstrations of Sycamore, xMEMS' revolutionary thin and lightweight full-range MEMS loudspeaker, and cooling, the world's first solid-state air pump-on-a-chip delivering active thermal management in devices where conventional fans can't go.Attendees will experience:1) AI glasses featuring Sycamore speakers and cooling for discreet, high-fidelity sound and heat management in ultra-thin eyewear2) Next-gen headphones featuring full-range Sycamore, paired with cooling to deliver the world's first active earcup ventilation3) SSD thermal management featuring cooling for higher sustained data transfers4) Plus a smartwatch with Sycamore, TWS earbud solutions with Cypress and Lassen, and thermal demos showcasing cooling at both chip and system levelsIn addition to hands-on demos, the seminar features deep-dive technical sessions from xMEMS engineers, covering performance testing, system integration, and product optimization for Sycamore and cooling across a variety of applications. Dedicated sessions on headphone and TWS implementations will offer further insight into how xMEMS solutions deliver superior fidelity, form factor reduction, and system-level benefits for consumer electronics."AI is changing how we interface with devices while also increasing processor and thermal loads," said Joseph Jiang, CEO of xMEMS Labs. "At xMEMS Live Asia, we'll demonstrate how Sycamore and cooling technologies are enabling a new generation of thinner and lighter-weight conversational AI interfaces and active thermal management for improved on-device intelligence and system performance."Registration is now open. Seating is limited. Click here for English, here for Simplified Chinese, or here for Traditional Chinese. Reserve your spot today to experience the future of conversational AI interfaces and AI thermal management!For more information about xMEMS and its solid-state solutions, visit xmems.com.Showcasing Live Demonstrations of AI Interface and Thermal Device Innovation Enabled by Sycamore and cooling on September 16 in Taipei and September 18 in Shenzhen.

Power modules have undergone a significant transformation- from simple power sources into critical enablers of system scalability, performance, and energy efficiency. This evolution is driven by the increasing demand for energy resilience, industrial transformation and enhancement. MEAN WELL, the global leader in standard power supply solutions, will adopt an application-oriented approach and work in close collaboration with distributors to showcase the effectiveness of their diversified product portfolios in practical applications at the upcoming Automation Taipei 2025.Partnering with distributors to develop complete solutions for automation, green energyTony Hsieh, Section Manager of MEAN WELL's Technical Service Center, indicated that the company's focus at this exhibition is on automation and green energy applications. Distributors will leverage their expertise in automation applications to incorporate MEAN WELL's green energy and backup power products.Hsieh further noted that the company's product designs follow cross-industry standards, efficiently fulfilling the application requirements of distributors in their specific sectors. In the field of humanoid robotics, MEAN WELL provides an array of charging power options, including wall-mounted designs, high-power density models, and fanless or fan-equipped configurations. These technologies can be easily adapted for various scenarios, including outdoor applications. Moreover, they support CAN bus communication and system-level integration, ensuring a stable power supply.The characteristics offer a broader range of collaborative models between MEAN WELL and its distribution partners. Partners leverage their technical expertise and capabilities to integrate MEAN WELL's standard products and related components as a foundational element in their offering, in addition to traditional product sales. Furthermore, by applying their professional integration capabilities—tailored to specific application scenarios—they co-develop comprehensive solutions that deliver significant added value.At Automation Taipei 2025, factory automation specialist YAU-YIH Enterprise will present a complete industrial robotic arm display solution powered by MEAN WELL's automation-oriented power supplies. RiKO, specialist in smart lighting control, will showcase the integration of MEAN WELL's Matter wireless and DALI wired dimming controllers with its proprietary sensors for use in industrial and commercial automation scenarios. JIDIEN will exhibit its most recent XDR and XTR series DIN-rail power supplies, as well as the next-generation mobile energy storage system, the NTN-5K, highlighting its advancements in energy storage applications and power integration.MEAN WELL's distributors will present backup power solutions for energy applications. Integrating redundant power supplies with control modules allows automation systems to securely retain operational progress, document work steps, and ensure a consistent power supply during outages, thereby reducing equipment loss and downtime expenses.Hsieh stated that MEAN WELL's target applications prioritize energy conservation, green energy and smart systems. These technologies prioritize high-efficiency energy conversion, support a variety of communication protocols, and enable remote monitoring. They can be integrated with other products to enhance energy storage and feedback systems in both grid-connected and off-grid setups, effectively fulfilling the stability and intelligent energy demands of modern automation systems. This presentation leverages distributors' expert integration capabilities, combining MEAN WELL power modules with green energy and backup products to create a unified system that provides significant value-added services to end customers.The simultaneous release of key products aims to greatly improve industrial control and energy storage applications solutionsMEAN WELL will exhibit a variety of key products at this exhibition, in addition to the two target applications. These products include the XDR series DIN-rail power modules, the BIC-2200 bidirectional power supply, the LOP-200/300 ultra-thin PCB power supplies, and other solutions that have garnered significant industry attention.The XDR, XDR-E, and XTR represent significant enhancements to MEAN WELL's DIN-rail power supply product line, effectively tackling spatial limitations, thermal management, and communication needs within the industrial and automation sectors. The three products are distinctly categorized: the XDR serves as the premium flagship with superior performance and extensive communication capabilities; the XDR-E presents a budget-friendly alternative; and the XTR accommodates three-phase input, rendering it appropriate for substantial loads and extended usage. series can function at full capacity at 60 degrees Celsius. These products meet international safety standards such as CB, TUV, UL, CE, and UKCA, with some models offering explosion-proof and maritime safety certifications.The BIC-2200 is a bidirectional AC/DC power supply designed to support various energy storage applications by facilitating both charging and discharging operations. It can be paralleled with a maximum of five units for a total output of 11kW, delivering 2200W of power per unit in a 1U ultra-slim rack-mount design. It possesses a bidirectional conversion efficiency of 93% and switching rates of one millisecond. Furthermore, it has an optional CAN bus interface for connection with energy management systems. This product is TUV/UL 62368-1 and CE certified, and adheres to the IEC 62477-1 grid-connection standard. It includes comprehensive protective measures, including islanding protection, overvoltage, overload, short-circuit, and overtemperature safeguards, rendering it appropriate for battery manufacturing and energy scheduling applications like vehicle-to-vehicle (V2G) systems.The LOP-200/300 series is an ultra-thin, high-power PCB-mounted power supply, measuring 4×2×1 inches and around 25mm in thickness. They are offered in 200W and 300W variants, featuring a maximum output capacity of 150% and an output voltage range of 12-54V. They can operate reliably at altitudes of up to 5,000 meters and within a temperature range of -40 to 80 degrees Celsius. The LOP-200/300 series has obtained numerous international safety certifications, including IEC 62368-1, IEC 60601-1, and IEC 61558-1/60335-1. They demonstrate a conversion efficiency of up to 94%, and a leakage current of 500µA, and an integrated auxiliary power supply of 12V/0.5A. The entire series comes with a three-year warranty.Product and application solution partner: MEAN WELL and distributors building a complete value chainAt Automation Taipei 2025, MEAN WELL will present the outcomes of its strategic evolution into a comprehensive product and application solutions partner. Distributors can leverage their specialized expertise, together with MEAN WELL's extensive standardized product line, to create a full value chain from product to application. Hsieh indicated that driven by a triadic strategy of module standardization, application orientation, and customization support, MEAN WELL is moving beyond the traditional role of a power supply manufacturer and evolving into an application-driven power solution partner. In the future, MEAN WELL will enhance its flexible integration and application extension capabilities across automation, energy storage, AI computing, medical care, and high-density equipment. Through close collaboration with industry partners, the company aims to deliver efficient, safe, and stable smart solutions.Caption: XTR Series Ultra-Thin, High-Efficiency, and Durable DIN Rail Power Supply.Caption: XDR-E Next-Generation Ultra-Thin DIN Rail Power Supply.