Taipei, December 11, 2025: Dimerco Express Group ("Dimerco") has announced that it is strengthening its integrated, Asia-focused logistics solutions to help customers capture growth from AI and "Taiwan+, China+" manufacturing while managing risks from congestion, regulatory changes and shifting capacity

At COMPUTEX 2025, ASUS showcased its comprehensive AI infrastructure solutions, targeting the computing needs of data centers, edge computing, and a wide range of intelligent applications. With a robust product portfolio, ASUS brings to life the NVIDIA AI Factory vision, illustrating how AI will be deeply embedded into enterprise IT infrastructure. This evolution continues to drive forward applications and services that shape the future of AI and high-performance computing

Technology news, product launches and show highlights from the event attendees available for download (PDF).

MiTwell is revolutionizing embedded AI computing through its innovative OSM (Open Standard Module) and AMC (Advanced Micro Computing) architectures, delivering a new generation of scalable, cross-architecture AI platforms. With its miniaturized SIOC (System In One Chip) design and flexible converter board technology, MiTwell empowers industries with compact yet powerful edge AI solutions that accelerate intelligent transformation across manufacturing, healthcare, and smart IoT applications. Recently, MiTwell achieved IEC 62443-4-1 certification, demonstrating its commitment to secure development practices. This certified process enables future system products to be developed under a rigorous cybersecurity framework - enhancing product cybersecurity, reliability, and trustworthiness across the company's AI computing solutions.Cross-Architecture and Scalable OSM EcosystemThe MiTwell OSM module series addresses diverse AI computing needs with leading-edge platforms including MediaTek Genio 520/720, Qualcomm QCS6490/5430, and Renesas RZ/V2N, delivering AI performance from 3.2 TOPS to 15 TOPS - covering a full range of edge sensing and inference applications.Through MiTwell's flexible Converter Board technology, OSM modules can seamlessly integrate with Qseven, SMARC, and COMe mini industrial standard carrier boards while supporting both x86 and ARM architectures. This unified design framework enables developers to transition and scale effortlessly, achieving efficient, compatible, and modular product development. Whether for rapid prototyping or final system deployment, MiTwell empowers customers to shorten design cycles, reduce integration complexity, and bring innovation to market faster.Miniaturization Excellence: The Birth of a Palm-Sized AI SystemPursuing the philosophy of "Smaller Size, Greater Performance," MiTwell leverages Advanced Embedded Computing principles by combining OSM modules with its patented 45×45 mm baseboard design to launch the new SIOC (System In One Chip) solution. This breakthrough condenses complete edge AI computing capabilities into a compact footprint, delivering high performance, low power consumption, and superior reliability - the ideal embedded platform for AIoT, industrial automation, and medical applications.In addition, MiTwell introduces a compact Vision AI PC system equipped with a built-in Full HD camera, supporting real-time image recognition and intelligent data analytics - enabling customers to rapidly deploy Vision AI solutions and usher in a new era of smart edge computing.Security and Trust: Building Industrial-Grade Cyber ResilienceIn industrial environments, safety and reliability are the foundation of every system. MiTwell has officially achieved TUV NORD Taiwan IEC 62443-4-1 certification for secure development processes and is actively progressing toward IEC 62443-4-2 and CRA (Cyber Resilience Act).This milestone underscores MiTwell's long-term commitment to product security lifecycle management, ensuring every solution not only delivers top-tier AI performance and design flexibility but also meets global industrial standards for cybersecurity, reliability, and trust.

TAIPEI, Taiwan - WeLink Solutions proudly introduces the RSQ11 NUC System, a next-generation industrial-grade computing platform built on Intel Twin Lake architecture. Designed for smart manufacturing, IoT, and edge AI applications, the RSQ11 combines high performance, efficiency, and rugged reliability within a compact form factor - now further reinforced by IEC 62443-4-1  certification for securing product development lifecycle process.Twin Lake Performance at the EdgePowered by Intel's latest Twin Lake processors, the RSQ11 delivers exceptional computing power with optimized energy efficiency - the ideal foundation for intelligent edge solutions.Intel N150 (4 cores, 6W TDP): Fanless efficiency for stable, low-power edge gateways.Intel N355 (8 cores, 15W TDP): Balanced performance for automation, machine vision, and AI inference.Combined with DDR5 memory, dual 2.5 GbE LAN, and modular M.2 expansion, the RSQ11 ensures seamless data flow, ultra-low latency, and flexible scalability - including integration with leading AI accelerator cards from Hailo or DeepX for enhanced edge intelligence.Cybersecurity Built into Every Stage - IEC 62443-4-1 CertifiedWeLink Solutions has achieved IEC 62443-4-1 certification, following a rigorous audit by TUV NORD Taiwan. This internationally recognized standard validates WeLink's secure product development lifecycle, ensuring that cybersecurity is embedded from initial design through final deployment.This certification reinforces WeLink's commitment to secure innovation across its portfolio - from modular computing platforms to ruggedized edge systems. For customers, it guarantees long-term security assurance, continuous vulnerability management, and  forward-looking readiness for upcoming regulations such as the EU Cyber Resilience Act (CRA)."As industries increasingly rely on connected intelligence, security must be built into the hardware foundation," said a company representative. "With IEC 62443-4-1 certification, our RSQ series combines industrial reliability with verified cybersecurity, empowering global partners to deploy smarter, safer edge solutions."Engineered for Industrial IntelligenceThe RSQ11 embodies WeLink's vision of compact power with infinite possibilities. From factory automation and intelligent transportation to AI-driven edge analytics, the RSQ11 adapts seamlessly to diverse industrial applications - delivering the reliability, scalability, and security essential for Industry 4.0 and beyond.

SK hynix Inc. (or "the company", www.skhynix.com) announced on December 7, 2025, that it has been named the winner of the Best Financially Managed Semiconductor Company Award(Achieving Greater than $1 Billion in Annual Sales) and the Outstanding Asia-Pacific Semiconductor Company Award at the Global Semiconductor Alliance(GSA) Awards 2025, held on December 4 PST in Santa Clara, California.The GSA Awards, organized annually since 1996, are regarded as the most prestigious honors in the global semiconductor sector, recognizing outstanding performance in leadership, financial results and industry reputation. SK hynix secured its second win in the financial management category following 2017, and its first recognition as the top Asia-Pacific semiconductor company. The dual achievement reinforces the company's reputation as a leading global technology innovator.While the semiconductor industry faced a severe downturn just two years ago, the company has been the fastest to rebound thanks to its advanced AI memory technologies including HBM. This performance has resulted in global recognition for its operational excellence and financial execution. SK hynix plans to continue building sustainable growth with its dominant leadership in the AI memory market.The awards reflect the company's proactive delivery of groundbreaking HBM solutions and its steadfast commitment to customer-centric performance in surging global AI demand. SK Chairman Chey Tae-won has consistently emphasized that securing technological competitiveness must remain unwavering, especially during challenging times. This long-term focus on technology investment and global cooperation network has contributed to the company's improved performance and reinforced financial health.Driven by this strategy, SK hynix has recorded historic performance throughout 2025. For the first three quarters, the company reported revenue of 64 trillion won and operating profit of 28 trillion won in total, positioning it well to surpass its previous full-year earnings record set in 2024(66 trillion won in revenue and 23 trillion won in operating profit).Financial health has also significantly strengthened. As of the end of the third quarter, cash and cash equivalents reached 27.9 trillion won, up 10.9 trillion won quarter-over-quarter, while interest bearing debt decreased to 24.1 trillion won— successfully transitioning into a net cash position of approximately 4 trillion won.To secure long-term leadership in AI memory, SK hynix is accelerating major investments. The Cheongju M15X fab, which opened its cleanroom earlier than planned in October, is on track to begin HBM mass production in the first half of next year. Construction of the first fab in the Yongin Semiconductor Cluster, launched in February, is also progressing ahead of schedule.With its recent financial achievements and continued expansion, SK hynix is expected to further solidify its AI memory leadership going forward.SK hynix was represented at the ceremony by Justin Kim, President & Head of AI Infra at SK hynix, and Sungsoo Ryu, President of SK hynix America. "It is a great honor to receive this award." Kim said, "We will continue to lead the market and create new value for customers as a Full-Stack AI Memory Creator, driving growth across the global AI ecosystem."