As the AI computing race accelerates and semiconductor manufacturing capacity is increasingly redirected toward advanced memory, the memory industry is shifting from price-driven competition to a battle over resource allocation and supply security...

Rugged edge computing brand – Cincoze will showcase its latest embedded computing solutions at COMPUTEX Taipei 2026, from June 2–5 (Hall 2, Booth Q0401a)...

Technology news, product launches and show highlights from the event attendees available for download (PDF).

Zhu Jinping, Executive Vice President, Head of BU Electronics Solutions, and Chairman of AT&S China, addressed the Austria Connect China 2026 conference today, offering key insights into the company's strategic positioning under China's evolving economic framework...

In the fiercely competitive European and other global markets, high-end applications such as automotive electronics, industrial control, networking equipment, and AI data centers face increasingly stringent requirements for supply chain transparency and device-identity recognition...

Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced that its HBM4E PHY and Controller IP is design-ready and has been adopted in customer AI ASICs. Implemented on TSMC's cutting-edge N2P process, the HBM4E PHY has successfully taped out on TSMC CoWoS-L