PEGATRON Corporation (PEGATRON) officially opened its booth at COMPUTEX 2026, presenting its AI Tech Maker strategy and its role in helping move AI from infrastructure planning to real-world deployment

PEGATRON Corporation (PEGATRON) announced a strategic collaboration with maxon, the Switzerland-based precision drive technology company. The two companies will jointly develop robotic joint drive technologies, motor modules, and integrated robotic systems. The collaboration will make its public debut at COMPUTEX 2026

Technology news, product launches and show highlights from the event attendees available for download (PDF).

Solid State Storage Technology Corporation (SSSTC), a subsidiary of Kioxia Corporation and a leading global SSD provider, is showcasing its enterprise SSDs designed for immersion cooling and engineered for AI-driven data centers, along with a comprehensive portfolio of industrial and enterprise SSD solutions.As generative AI and high-density computing evolve, thermal management is critical. To address this, SSSTC has optimized its SSDs for immersion cooling environments by enhancing corrosion resistance through specialized materials, component protection, and structural design. The lineup includes the SATA ER3, ER4, and ER5 series, as well as the PCIe U.2 PJ1 and EJ5 series.These SSDs are optimized for immersion cooling environments, where systems are submerged in non-conductive dielectric fluids. By leveraging the high heat capacity and convective properties of liquids, heat can be efficiently dissipated through fluid circulation and heat exchange. This approach reduces reliance on traditional air cooling while improving Power Usage Effectiveness (PUE) and overall system reliability.SSSTC is also highlighting a range of industrial and enterprise SSDs optimized for AI and edge applications. Industrial SSDs support Edge AI and harsh environment deployments, with operating temperatures ranging from -40-degrees Celsius to 85degrees Celsius, along with anti-vibration and shock-resistant designs for outdoor and industrial environments. The pSLC architecture enhances endurance for sustained write-intensive workloads, while a multi-tier PLP (Power Loss Protection) framework -  including hardware PLP, firmware PLP, and PLN -  provides flexible data protection.Enterprise eTLC SSDs are designed to deliver stable performance for AI workloads, offering endurance options of 1 and 3 DWPD over a five-year period for varying workload intensities. Under sustained workloads, they maintain more than 90% random IOPS consistency, minimizing performance fluctuations. Firmware optimized for high-density computing enables low latency operation, while capacitor-based PLP and immersion cooling support ensure reliable performance in demanding deployment environments.With more than 18 years of in-house firmware development expertise, SSSTC understands diverse storage requirements across industries and provides flexible customization options, including configurable over-provisioning, lifespan and capacity optimization, performance and power tuning, and application-specific firmware development. SSSTC remains committed to helping customers build stable, efficient, and sustainable AI storage infrastructures.Founded in 2008, SSSTC became a subsidiary of Kioxia Corporation in 2020 and delivers high-quality SSDs through in-house firmware and NAND expertise. For more information, visit the SSSTC website.Remark: PCIe is a registered trademark of PCI-SIG.Credit: SSSTC

As AI data center rapidly scales toward the gigawatt (GW) level, energy management is evolving from a supporting function into a defining strategic pillar. Against this backdrop, Infineon Technologies is redefining power infrastructure of AI era through its comprehensive "From Grid to Core" strategy, integrating energy efficiency, power density, and system resilience from the electrical grid to the processor core.Scaling AI: Strategic Power Solutions MatterThe evolution of artificial intelligence (AI) has accelerated far beyond the trajectory once predicted by Moore's Law. As AI models continue to expand in parameter scale and real-time inference becomes increasingly critical, demand for computing power is rising at an unprecedented pace.Today, the power consumption of a single GPU is rapidly approaching the kilowatt level, and the power density of a server rack has increased significantly from less than 60kW in the past to exceeding 100kW, now moving toward a new threshold in the megawatt range.This is not just numerical growth; it represents a fundamental shift in power architecture. As AI computing clusters expand rapidly, traditional 48V busbars and AC power distribution architectures are quickly approaching their physical limits in terms of power loss, thermal management, and spatial constraints.Adam White, President of Infineon's Power & Sensor Systems Division, emphasized that future competition in AI infrastructure will no longer be limited to chip performance. Instead, it will be a cross-disciplinary integration battle encompassing power electronics, materials technology, and system architecture.From Grid to Core: Rethinking the power delivery architectureAt this critical turning point for the industry, Infineon's competitive advantage lies not in a single breakthrough product, but in its ability to orchestrate and optimize the entire power delivery chain at the system level."From Grid to Core" is more than a product strategy - it is a multi-phase architectural framework designed to reshape the future AI energy chain. Developed through early collaboration with global hyperscalers and ecosystem partners, the strategy enables Infineon to address evolving AI power demands across every phase of infrastructure, from utility grids to processor-level power management.Power grid: Enabling a sustainable, high-efficiency power with HVDCAt the front end of the data center, power infrastructure is transitioning from traditional mechanical systems to highly integrated solid-state solutions. Future AI facilities are expected to increasingly adopt decentralized DC microgrids, enabling greater efficiency, flexibility, and resilience in energy management.By leveraging silicon carbide (SiC) technology in solid-state transformers (SSTs), system weight can be dramatically reduced - from nearly 20 tons to approximately 500 kilograms—while simultaneously improving overall energy efficiency by more than 1%. Beyond optimizing space utilization and operational costs, this advancement signals a broader industry migration from electromechanical infrastructure toward semiconductor-driven power systems.As SSTs and related technologies become integrated into AI power infrastructure, a multi-billion-dollar semiconductor opportunity is emerging across next-generation energy systems.At the same time, the power grid is evolving beyond its traditional role as just an energy source. Through digitally controlled power systems with real-time monitoring and remote management capabilities, combined with solid-state circuit breakers (SSCBs) featuring microsecond-level response times, the grid is becoming an intelligent energy platform capable of continuous optimization and predictive management.Server rack: Reshaping power density and maximizing efficiencyAs data centers advance toward GW-scale deployments, power distribution architecture is undergoing a fundamental redesign. Infineon is driving the industry's transition from traditional 48V systems to ±400V and 800V high-voltage DC architectures. Through the design of three-phase power sidecars, Infineon is restructuring power supply and computing systems to establish a more efficient and flexible power distribution model.At the same time, the power architecture of AI data centers is following a clear evolutionary path: moving from integrated server rack designs to high-voltage DC and sidecar power supply configurations, and ultimately advancing to gigawatt-scale infrastructures that incorporate DC microgrids.Meanwhile, The high-frequency characteristics of gallium nitride (GaN) components enable intermediate bus converters (IBCs) to achieve over 98% conversion efficiency and exceptionally high power density in an extremely compact form factor, significantly reducing power transmission losses and freeing up more space for AI computing resources.Processor core: Power density and new architectures for next-gen AI computeAt the processor core—the final stage of power delivery—the challenge shifts toward managing extreme current density and ultra-fast transient response.To support next-generation GPUs requiring massive current delivery and rapid load transitions, Infineon has introduced a digital multiphase PWM controller alongside the industry's first TLVR four-phase power module. These technologies are engineered to provide highly stable, efficient, and responsive power delivery for AI processors operating under increasingly demanding workloads.In response to the next generation of GPUs demanding ultra-high current and rapid load changes, Infineon has introduced digital multiphase PWM controllers and the industry's first TLVR quad-phase module. By leveraging high-precision telemetry and digital control technologies, power systems have transformed from energy suppliers into intelligent platforms capable of real-time monitoring, prediction, and optimization.From AI data center to physical AIIf data centers form the foundation of AI computing power, the physical world will be where AI's true value is ultimately realized. As AI increasingly expands into humanoid robots, autonomous systems, and intelligent manufacturing equipment, demands for energy efficiency, real-time responsiveness, and system reliability will become even more critical.Infineon is extending its long-established expertise in power management beyond data centers into the emerging era of Physical AI. By integrating sensing technologies, actuate, security and connectivity solutions, and high-efficiency power modules, the company is enabling a comprehensive functional blocks that empower humanoid robots to perceive, think, act and connect, safely and secured in a real-world environment.Push the boundaries of power technology in AI era"We Power AI" is not just a slogan for Infineon—it is a concrete commitment to the future of the industry. From gigawatt-scale data centers to physical AI, Infineon continues to push the boundaries of power technology, ensuring that every watt of energy is transformed into the greatest possible value for AI.As the industry advances toward the next generation of computing, energy management will become the decisive key to truly unlocking the full potential of AI. In this wave of transformation, Infineon is joining forces with ecosystem partners to stand at the forefront of defining the future.Editor's Note: Adam White will deliver a keynote address at COMPUTEX 2026 on June 4 titled  "Infineon Powering AI from Grid to Core to Physical AI."  The session will explore emerging trends and strategic opportunities in power infrastructure of AI era.Credit: Infineon

ZEISS, a global leader in optics and optoelectronics, will bring the quality discussion to the official COMPUTEX 2026 Forum stage for the first time this year, highlighting the growing role of quality in scaling AI hardware.As demand for AI infrastructure accelerates, quality is shifting from a manufacturing support function to a direct driver of performance, yield and delivery readiness. While public attention often centers on AI models, ZEISS says reliable hardware execution is becoming a decisive factor in AI deployment.Behind every AI interaction are massive data centers powered by thousands of GPUs. As systems scale from chip to rack, defects in semiconductor packaging, printed circuit boards (PCB/A), cooling systems and high-speed interconnects can affect uptime, deployment speed and total cost."With compute demand surging, manufacturers face record orders, but the challenge is delivering at scale with consistent quality," said Clive Yen, Global Head of Electronics Customer Segment, ZEISS Industrial Quality Solutions. "As systems grow more complex, quality becomes critical to reliable deployment. This is why we work across Taiwan's ODM ecosystem and the full AI server value chain to enable consistent, scalable quality.""At scale, even small defects can become major bottlenecks," said Tonmoy Kundu, Global Head of Sales, ZEISS Research Microscopy Solutions. "Manufacturers need faster insight, tighter process control and trusted failure analysis to accelerate next-generation AI hardware."ZEISS says it offers one of the industry's most comprehensive quality portfolios across the AI hardware value chain, supporting customers from semiconductor packaging and PCB inspection to liquid cooling, optical connectivity and final rack integration.At the forum, ZEISS will showcase solutions for advanced high-bandwidth memory (HBM), where rising stack heights and shrinking interconnect dimensions require high-resolution, non-destructive inspection and deep defect analysis.The company will also present metrology solutions for co-packaged optics (CPO), where ultra-tight tolerances for FAU and MPO connectors are essential to maintain alignment, coupling efficiency and long-term transmission reliability in 51.2T+ networks.At the exhibition hall (Booth J1109 | TaiNEX Hall 1, Taipei), ZEISS will showcase technologies spanning wafer process control, advanced packaging, X-ray inspection, electron microscopy, light and digital microscopy, and coordinate measuring machines. Applications will focus on chip manufacturing, PCB reliability, thermal management systems, connector quality and L10-L11 rack mechanical parts assembly.COMPUTEX 2026 runs June 2-5 in Taipei, where ZEISS will position quality as a foundational enabler of the next wave of AI growth. ZEISS will speak at the official COMPUTEX 2026 Forum on June 4, 4:30 p.m. to 4:55 p.m. at TaiNEX 2, Room 701, presenting "Quality Innovation Across the AI Chip-to-Rack Stack." The session will feature Tonmoy Kundu and Clive Yen.