PEGATRON Corporation (PEGATRON) announced a strategic collaboration with maxon, the Switzerland-based precision drive technology company. The two companies will jointly develop robotic joint drive technologies, motor modules, and integrated robotic systems. The collaboration will make its public debut at COMPUTEX 2026

PEGATRON, a globally recognized total server solutions provider, today unveiled its next-generation AI infrastructure portfolio and AI factory validation framework at COMPUTEX 2026. Powered by NVIDIA Vera Rubin platform , NVIDIA HGX Rubin NVL8, and NVIDIA RTX PRO Servers, and aligned with the NVIDIA DSX AI factory reference design, Pegatron is advancing how AI factories are designed, validated, and deployed - from digital twin simulation to production-ready infrastructure

Technology news, product launches and show highlights from the event attendees available for download (PDF).

Solid State Storage Technology Corporation (SSSTC), a subsidiary of Kioxia Corporation and a leading global SSD provider, is showcasing its enterprise SSDs designed for immersion cooling and engineered for AI-driven data centers, along with a comprehensive portfolio of industrial and enterprise SSD solutions.As generative AI and high-density computing evolve, thermal management is critical. To address this, SSSTC has optimized its SSDs for immersion cooling environments by enhancing corrosion resistance through specialized materials, component protection, and structural design. The lineup includes the SATA ER3, ER4, and ER5 series, as well as the PCIe U.2 PJ1 and EJ5 series.These SSDs are optimized for immersion cooling environments, where systems are submerged in non-conductive dielectric fluids. By leveraging the high heat capacity and convective properties of liquids, heat can be efficiently dissipated through fluid circulation and heat exchange. This approach reduces reliance on traditional air cooling while improving Power Usage Effectiveness (PUE) and overall system reliability.SSSTC is also highlighting a range of industrial and enterprise SSDs optimized for AI and edge applications. Industrial SSDs support Edge AI and harsh environment deployments, with operating temperatures ranging from -40-degrees Celsius to 85degrees Celsius, along with anti-vibration and shock-resistant designs for outdoor and industrial environments. The pSLC architecture enhances endurance for sustained write-intensive workloads, while a multi-tier PLP (Power Loss Protection) framework -  including hardware PLP, firmware PLP, and PLN -  provides flexible data protection.Enterprise eTLC SSDs are designed to deliver stable performance for AI workloads, offering endurance options of 1 and 3 DWPD over a five-year period for varying workload intensities. Under sustained workloads, they maintain more than 90% random IOPS consistency, minimizing performance fluctuations. Firmware optimized for high-density computing enables low latency operation, while capacitor-based PLP and immersion cooling support ensure reliable performance in demanding deployment environments.With more than 18 years of in-house firmware development expertise, SSSTC understands diverse storage requirements across industries and provides flexible customization options, including configurable over-provisioning, lifespan and capacity optimization, performance and power tuning, and application-specific firmware development. SSSTC remains committed to helping customers build stable, efficient, and sustainable AI storage infrastructures.Founded in 2008, SSSTC became a subsidiary of Kioxia Corporation in 2020 and delivers high-quality SSDs through in-house firmware and NAND expertise. For more information, visit the SSSTC website.Remark: PCIe is a registered trademark of PCI-SIG.Credit: SSSTC

Elitegroup Computer Systems (ECS), a leading global provider of motherboards, mini PCs, and computing solutions, will participate in COMPUTEX 2026 from June 2 to 5, 2026, at Taipei Nangang Exhibition Center, Hall 1, Booth J1317a. Under the theme Power AI Computing, ECS will present its latest motherboards and LIVA Mini PCs, highlighting how compact and scalable PC platforms can support AI Agent workloads, Edge AI processing, smart healthcare applications, and embedded deployments.ECS will demonstrate how LIVA Mini PCs can be flexibly deployed in edge computing environments to support AI-assisted information retrieval, private knowledge base applications, healthcare data monitoring, and embedded commercial deployments. Through these demonstrations, ECS will highlight the role of LIVA Mini PCs in data processing, application execution, real-time monitoring, and vertical use cases. ECS will also showcase motherboard platforms with high-performance expansion capabilities, providing customers with a broader choice of computing foundations for AI and edge applications.Showcasing AI Agent Applications in PC EnvironmentsECS will showcase OpenClaw AI Agent applications running on an AMD desktop PC at its booth, demonstrating how AI Agent capabilities can be applied in PC-based environments. The demonstration will cover common scenarios such as system status queries, information search, and content summarization, showing how AI Agents can help users streamline daily operations and improve information processing efficiency. Through this demonstration, ECS will further present the flexibility and practical value of integrating AI Agent applications into commercial PC environments.LIVA Z11 PLUS. Credit: ECSLIVA One H810. Credit: ECSExtending Edge AI into Healthcare and Private Knowledge ApplicationsECS will showcase the LIVA Z11 PLUS mini PC in two Edge AI and data-driven scenarios: healthcare monitoring and private knowledge base applications. In the healthcare demonstration, the Z11 PLUS will support hemodialysis simulation and FHIR BOX applications, showing how a compact mini PC can serve as an edge computing node for medical data collection, real-time monitoring, and data format conversion.The knowledge base scenario will run a local database with a natural language interface, enabling users to query product and business information more intuitively. This highlights the role of mini PCs in enterprise information access, private data environments, and on-site applications where sensitive information needs to be managed locally. Powered by Intel Core Ultra processors, the LIVA Z11 PLUS provides high-speed storage, dual networking, and USB4 connectivity to support data-intensive Edge AI applications.LIVA Z15 PLUS. Credit: ECSExpanding the LIVA Lineup from AI-ready Performance to Embedded FlexibilityBeyond AI application demonstrations, ECS will present its full LIVA Mini PC lineup and next-generation platforms for commercial, edge, and embedded deployments. The new LIVA Z15 PLUS, built on the Intel Wildcat Lake platform with integrated NPU-based AI acceleration, will be a key highlight of ECS’s LIVA showcase, addressing high-performance commercial use, AI-assisted workloads, and edge computing applications.ECS will also feature the LIVA One H810, extending the LIVA One series' upgradeable socket-type design with the Intel Core Ultra LGA1851 platform. For low-power and embedded applications, the LIVA Z4F offers fanless reliability, while the LIVA Q4 combines an ultra-compact form factor with 45W USB Type-C power input for mobile, space-constrained, and flexible installation environments.

ZEISS, a global leader in optics and optoelectronics, will bring the quality discussion to the official COMPUTEX 2026 Forum stage for the first time this year, highlighting the growing role of quality in scaling AI hardware.As demand for AI infrastructure accelerates, quality is shifting from a manufacturing support function to a direct driver of performance, yield and delivery readiness. While public attention often centers on AI models, ZEISS says reliable hardware execution is becoming a decisive factor in AI deployment.Behind every AI interaction are massive data centers powered by thousands of GPUs. As systems scale from chip to rack, defects in semiconductor packaging, printed circuit boards (PCB/A), cooling systems and high-speed interconnects can affect uptime, deployment speed and total cost."With compute demand surging, manufacturers face record orders, but the challenge is delivering at scale with consistent quality," said Clive Yen, Global Head of Electronics Customer Segment, ZEISS Industrial Quality Solutions. "As systems grow more complex, quality becomes critical to reliable deployment. This is why we work across Taiwan's ODM ecosystem and the full AI server value chain to enable consistent, scalable quality.""At scale, even small defects can become major bottlenecks," said Tonmoy Kundu, Global Head of Sales, ZEISS Research Microscopy Solutions. "Manufacturers need faster insight, tighter process control and trusted failure analysis to accelerate next-generation AI hardware."ZEISS says it offers one of the industry's most comprehensive quality portfolios across the AI hardware value chain, supporting customers from semiconductor packaging and PCB inspection to liquid cooling, optical connectivity and final rack integration.At the forum, ZEISS will showcase solutions for advanced high-bandwidth memory (HBM), where rising stack heights and shrinking interconnect dimensions require high-resolution, non-destructive inspection and deep defect analysis.The company will also present metrology solutions for co-packaged optics (CPO), where ultra-tight tolerances for FAU and MPO connectors are essential to maintain alignment, coupling efficiency and long-term transmission reliability in 51.2T+ networks.At the exhibition hall (Booth J1109 | TaiNEX Hall 1, Taipei), ZEISS will showcase technologies spanning wafer process control, advanced packaging, X-ray inspection, electron microscopy, light and digital microscopy, and coordinate measuring machines. Applications will focus on chip manufacturing, PCB reliability, thermal management systems, connector quality and L10-L11 rack mechanical parts assembly.COMPUTEX 2026 runs June 2-5 in Taipei, where ZEISS will position quality as a foundational enabler of the next wave of AI growth. ZEISS will speak at the official COMPUTEX 2026 Forum on June 4, 4:30 p.m. to 4:55 p.m. at TaiNEX 2, Room 701, presenting "Quality Innovation Across the AI Chip-to-Rack Stack." The session will feature Tonmoy Kundu and Clive Yen.