As the AI computing race accelerates and semiconductor manufacturing capacity is increasingly redirected toward advanced memory, the memory industry is shifting from price-driven competition to a battle over resource allocation and supply security. The rapid expansion of high-bandwidth memory (HBM) production continues to consume advanced fabrication capacity, constraining the supply of conventional memory products and creating persistent shortages across the market. This concentration of high-end production has widened the supply-demand gap, driving the average selling prices of certain premium memory products to levels eight to ten times higher than previous norms

Rugged edge computing brand – Cincoze will showcase its latest embedded computing solutions at COMPUTEX Taipei 2026, from June 2–5 (Hall 2, Booth Q0401a). Cincoze will display its full range of edge computing solutions around the theme of "Smarter, Faster, More Reliable - Powered by Edge AI" encompassing the full spectrum of edge application environments in four dedicated zones, including DIN-Rail computers, industrial panel PCs and monitors, rugged embedded computers, and GPU embedded computers

Technology news, product launches and show highlights from the event attendees available for download (PDF).

Interested in knowing how to solve the microcrack problem in through-glass via (TGV) fabrication? Interested in knowing how to supply 1,000 Watts, 1 Volt and 1,000 Amperes electricity to semiconductor IC chips in an AI multichip package? Interested in knowing how to increase the glass panel size for manufacturing AI multichip packages? If so, visit iCometrue® at Booth M0957, Hall 1, 4F, Taipei Nangang Exhibition Center during SEMICON Taiwan 2026!Benefiting from their excellent thermal, mechanical, and electrical properties, glass substrates have emerged as a promising platform for large-size, high-performance AI multichip packages. At SEMICON Taiwan 2025 last year, iCometrue® exhibited the Through-Polymer-Via (TPV) Connector, a novel technology that provides vertical interconnection in Glass Cores for use in Glass Interposers and BGA substrates to solve the microcrack problem in glass substrates caused by TGV fabrication.At SEMICON Taiwan 2026 this year, iCometrue® plans to exhibit solutions for delivering over 1,000 W and over 200 A of power supply to the high-performance AI multichip package. The solutions include:(1) Embedding Cu Blocks in Glass Substrates for Power/Ground DeliveryCu blocks are used to replace TPVs/TGVs for power/ground delivery. This approach significantly reduces the number of TPVs/TGVs originally used for power/ground delivery through the glass substrate by 80%, thereby lowering fabrication complexity, improving manufacturing yield, and reducing manufacturing costs.A current high-performance AI multichip package, comprising GPU chips and HBM modules, has more than 10,000 I/Os for power, ground, signal, and clock distribution, which requires more than 10,000 TGVs/TPVs in the glass substrate. 80% of these TGVs/TPVs in the glass substrate are used for power/ground delivery. Using Cu blocks to replace TPVs/TGVs for power/ground delivery results in an 80% reduction in the number of TPVs/TGVs, thereby lowering fabrication complexity, improving manufacturing yield, and reducing manufacturing costs. Nowadays high-performance semiconductor IC chips in AI multichip packages typically require more than 1,000 W of power. Since power (P) is given by P=I×V, a 1 V operation voltage of semiconductor IC chips corresponds to a current over 1,000 A.As shown in Fig. 1, the embedded Cu blocks provide the power/ground voltage and current paths that would otherwise require a large number of TPVs or TGVs in the glass substrate. The remaining TPVs/TGVs (approximately 20%) are reserved for signal and clock transmission. Consequently, the embedded Cu blocks significantly reduce the number of TPVs/TGVs in the glass substrate.The formation of embedded Cu blocks in glass substrates is achieved by inserting Cu blocks into pre-formed large holes in the glass substrate. This process is similar to the TPV Connector embedding process in glass substrates previously disclosed at SEMICON Taiwan 2025.(2) Packaging Voltage Converter/Regulator (VCR) chips in AI Multichip PackagesThe VCR chips are packaged vertically under and close to the GPU chip within the AI multichip package. The embedded VCR chips convert the 1,000 W, 48 V, 21 A power supply from external circuits to 1,000 W, 1 V, 1,000 A for the GPU chip. As shown in Fig. 1, copper blocks provide a low resistance power delivery system from external circuits to the embedded VCR chips, and resulting in reduction of the heat generation.(3) Embedding Si Bridges, DTCs, and VCR chips in the Frontside Interconnection Scheme Over the Glass SubstrateAt SEMICON Taiwan 2025, iCometrue® demonstrated that Si bridges and DTCs are embedded in large holes within the glass substrate. Here in Fig. 1, iCometrue® shows that Si bridges, DTCs, and VCR chips are instead embedded in the frontside interconnection scheme over the glass substrate, while the TPV connectors and copper blocks are embedded in large holes in the glass substrate. This approach further simplifies the fabrication of the AI multichip package using a glass substrate.(4) Installing Electrical/Optical Connectors at the Edges of the AI Multichip PackageWhen glass substrates are used for multichip packaging, power and signals are usually input and output via the solder balls on the bottom of the multichip package through the backside interconnection (under the glass substrate), TPVs/TGVs (in the glass substrate), and the frontside interconnection (over the glass substrate) to the semiconductor chips. As discussed above, the fabrication of TPVs/TGVs is one of the major challenges in glass-substrate technology. To solve this problem, iCometrue® has introduced an innovative architecture that enables a large-size System-on-Panel (SOP) multichip package using a thick glass substrate without TPVs/TGVs.As shown in Fig. 2, power and signals are delivered through electrical and/or optical connectors located at the edges of the multichip package rather than through solder balls on the bottom of the package. The glass substrate is used as a panel-level fabrication platform and remains in the final package to provide mechanical support. An interconnection scheme (metal line and polymer) is built on the glass substrate, with electronic components such as interconnection bridges, integrated passive devices (IPDs), and VCR chips embedded within it. Semiconductor chips (CPU, GPU, ASIC, HBM) are then flip-chip bonded onto the interconnection scheme above the glass substrate. Electrical and/or optical connectors, together with passive components, are mounted on the top surface of the interconnection scheme using surface-mount technology (SMT).Credit:iCometrueBecause power and signals are supplied by the edge connectors instead of bottom solder balls, signal transmission and power distribution from the edge connectors to semiconductor chips are through the interconnection scheme. Consequently, no TPVs or TGVs are required in the glass substrate, enabling large-size System-on-Panel (SOP) packages. Further, since no TPVs or TGVs are required, a thicker glass substrate can be used, which greatly reduces the bending of the glass panel. Thereby, the size of the glass panel used in the fabrication can be greatly increased.More than Moore: The Use of Glass Substrates for Multichip PackagingiCometrue® is pioneering a new era of advanced multichip packaging by introducing glass substrates with embedded TPV Connectors and Cu blocks, providing a practical and scalable alternative to conventional TGV-based processes. Further, embedding Si bridges, DTCs, and VCR chips in the frontside interconnection scheme over the glass substrate simplifies the fabrication of the AI multichip package. Combined with the TPV/TGV-free thick glass substrate architecture for System-on-Panel (SOP) packaging, these technologies establish a foundation for the next generation of multichip integration, extending Moore's Law into the era of glass-based system packaging and accelerating the advancem

Keywave Technology is a fabless semiconductor company founded in December 2022 that specializes in radio frequency (RF) integrated circuit (IC) design and advanced radar sensing solutions. Capitalizing on the explosive growth of Edge AI and opportunities for technological innovation, the company builds ultra-low-power microwave radar chips, modules and spatial sensing devices to track multiple targets with centimeter-level precision spatial positioning applications.Keywave Technology currently business focuses primarily on the UK market, where it has achieved significant success in projects spanning lighting, energy-saving systems, HVAC optimization, and smart applications involving precise occupancy tracking, smart environmental sensing and human-machine interaction.Jenny Cheng, founder and CEO of Keywave, established an office in Zhubei as early as 2023 and marked a strategic expansion into Taiwan's core semiconductor and electronics ecosystem. Recognized strong growth of Taiwan’s electronics manufacturing and semiconductor market, she formally launched an "Asia Business Division" team in 2026 with over 20 members.Following collaboration and engagement with major Taiwanese electronics manufacturing, and OEM/ODMs, Keywave has developed two radar sensor product lines, operating at 5.8 GHz and 24 GHz targeting markets such as AI robotics, smart spaces, smart buildings, automation, and edge AI sensing. Through proof-of-concept (PoC) initiatives and product design, the Keywave R&D team has focused on applications requiring high-precision spatial sensing and trajectory tracking. These innovative products, characterized by high accuracy, rapid sensing capabilities, energy efficiency, and cost-effectiveness. Now these solutions are being officially introduced to Taiwan’s industrial internet of things (IoT) and automation sector, paving the way for new business opportunities.MP Kan, VP of Technology and CTO at Keywave, outlined the shortcomings of traditional microwave radar and infrared (PIR) sensing technologies. Benchmarked against radar devices from leading global analog integrated circuits (ICs) manufacturers, he identified the primary drawbacks of these existing solutions: false detections leading to unintended activations, a technical inability to detect motionless objects or resting human bodies, and issues regarding high costs and excessive power consumption.In contrast, Keywave KW007, the compact 5.8GHz ultra-low-power radar sensor, achieves exceptional efficiency by drawing only 30µA to 100µA of operating current, enabling continuous motion detection for years on a single AA battery depending on sensitivity and the selected detection distance.This exceptional energy efficiency relies on smart sensing algorithm with proprietary multi-dimensional "Space and Time" sensing technology. This approach differs from traditional radar designs, which utilize high-performance DSP chips and extensive memory, resulting in inflated costs and high power consumption.In June 2026, Kan was invited to France to attend the inaugural European Semiconductor FSNP Meetup. Held on June 4, 2026, at Château de Seguin near Bordeaux, this was an exclusive, invitation-only event for the semiconductor industry, co-hosted by the European chip R&D platform EuroCDP and Silicon Catalyst.EU. He presented this ultra-low-power microwave radar sensing technology based on time-and-space correlation algorithms. The technology’s key strength lies in its integration of proprietary "Spatial Intelligence" and trajectory tracking, enabling it to accurately distinguish actual human movement from environmental noise in dynamic settings. It currently supports a sensing range of up to 20 meters and effectively prevents false triggers caused by natural wind, indoor fans, vibrations, or environmental noise.By combining radar sensors with AI technology, Keywave KW307, a 24GHz human presence and occupancy sensing module, enables the development of advanced, intelligent applications capable of detecting not only people and objects but even micro-motions like typing, breathing, or minor gestures. Given the regulatory restrictions in EU’s General Data Protection Regulation (GDPR) and California's CCPA/CPRA regarding the major concerns of camera-based systems capturing real-person images or personal identifiers, Keywave’s radar sensors have secured a significant market advantage by measuring motion, distance, and velocity.These microwave radar sensors facilitate applications such as office occupancy monitoring, object trajectory analysis, and climate and lighting control, while integrating seamlessly with the Industrial IoT devices, robotics, and smart home sectors to rapidly expand the scope of smart use cases. Kan also revealed that the next-generation radar sensor currently under development aims to push detection boundaries from a few hundred meters to several kilometers. This will explore the business potentials for deeper integration with drone and robotics applications to assist autonomous systems with spatial awareness and reliable presence detection in variable or low-light conditions.The most impressive technological breakthrough of Keywave Technology lies in its ability to achieve precise stationary presence detection and micro-motion tracking by analyzing the minute chest movements caused by breathing, even when a person is completely motionless. The current popular demonstration of Smart Spaces include powering privacy-compliant occupancy tracking for automated lighting and optimized HVAC adjustments. There are more use cases in the industrial controlling and detecting systems.The company is currently actively forging partnerships across various sales channels, including IC distributors, ODM/OEM manufacturers, and system integrators. In addition to offering engineering evaluation kits, development boards and support to technical teams, Keywave is seeking strategic partners to collaborate closely on the co-design of new applications with hardware and software system integrators.For further viewing the ultra-low-power radar porducts of Keywave, the company will exhibit at Microelectronics UK 2026, taking place at ExCeL London on September 29–30, 2026. The showcasing booth stand is located at Stand G16, ExCeL London, Royal Victoria Dock. At Keywave, we have been working on exciting new developments designed to help our partners navigate complex engineering challenges, optimize performance, and drive innovation. Visiting our booth will give you an exclusive look at our latest product demonstrations, upcoming technology roadmap, and a chance to speak directly with our technical experts.Credit:Keywave TechnologyKeywave radar sensor accurately tracks and records the movement trajectories of individuals.Credit:Keywave Technology

Rapid evolution of High-Performance Computing (HPC) and artificial intelligence chips for Hyperscalers and tech giants continue pushing large sized silicon demands. As a core element of semiconductor value creation, advanced packaging technology is scaling the stacking of more computing cores, more high-bandwidth memory, as well as the adoption of modular chiplet integration to overcome physical boundaries. Leading semiconductor manufacturers are expanding package dimensions to unprecedented footprints, currently reaching sizes of 100, 120, with projections moving beyond 180 mm to support large-format AI-driven advanced packages.The semiconductor industry is responding and shifting toward solutions that combine large-scale mass production with large-format packaging capabilities. Square sized substrates offer a distinct area utilization advantage to accommodate more large-form-factor chips simultaneously by moving away from round wafers to large rectangular panels. This is improving cost efficiency and addressing the challenges of thermal warpage and high-density interconnects associated with massive AI packages.Glass substrates are emerging as a key technology for advancing panel-level packaging from pilot experiments to active equipment qualification and commercialization verification. Consequently, Redistribution Layer (RDL) wet process and ECD equipment has become a critical driver of this transition and a key step in glass substrate manu-facturing. Key production tools including Electrochemical Deposition (ECD), cleaning, developing, etching, and stripping are not only vital to glass core substrate manufacturing, but also central to achieving high yields and mass production capabilities in advanced packaging technologies such as fan-out panel-level packaging (FOPLP) and Chip-on-Panel-on-Substrate (CoPoS). The wet processing equipment has garnered significant market attention.Omni production platform supports cross-sized substrates in 310, 510 and 700mm panelManz Asia, has successfully delivered Omni 310 system, which is the world’s first $310\text{mm} \times 310\text{mm}$ ECD wet chemistry system in early 2026. The system uses an electrochemical deposition module as its core, combining wet processing tools including cleaning, developing, plating, etching, stripping, and dual mechanisms support for both spin and spray operation. This new platform addresses the adaption to varying rectangular substrates.At SEMICON Taiwan 2026, Manz Asia expanded its portfolio with the launch of the cross-sized Omni series production systems. Engineered for varying panel dimensions, packaging architectures, and strict process requirements, this series feature the Omni 310, Omni 510, and Omni 700 to deliver optimized panel-level packaging (PLP) solutions across 310mm, 510mm, and 700mm panel sizes to meet the requirements of advanced PLP technology roadmaps including FOPLP, CoPoS, and Glass core TGV manufacturing.Take early-move positioning for Glass Core substrate aiming to tackle Through-Glass Via challengesRapid advancements in CoPoS are driving the shift from organic substrates to Glass Core, with TGV metallization, seed-layer formation, and copper via filling emerging as key process challenges. The Omni Series RDL platform integrates glass surface modification, cleaning, electroless copper plating, and electroplating to enhance copper adhesion and enable reliable TGV metallization and filling. Major Benefits of Omni series include.High performance ECD technology: The system offers excellent capabilities for filling high-aspect-ratio through-vias. When combined with an optimized seed layer and specialized plating chemistry, this process enables void-free via filling, delivering a highly stable and critical solution for electroplating on glass carrier substrates.High-precision glass etching technology: Featuring robust glass micro-machining capabilities, this technology supports the processing of 0.4 mm glass substrates and the creation of $20\ \mu\text{m}$ micro-vias. It offers TGV process capabilities with aspect ratios of up to 1:20, providing a critical advantage for achieving deep, fine-featured vias. Therefore, the system addresses the challenges of high-density TGV designs and marks a milestone in establishing a mass-production platform for next-generation packaging architectures.Empowering Heterogeneous Integration with advanced RDL for High-Precision Multi-Layer InterconnectionWith 40 years of in-house R&D expertise in RDL processing, Manz Asia has developed extensive expertise across PCB, IC substrate, display panel, and semiconductor packaging applications, and is now building strong collaborations with global IDM and OSAT clients. By helping customers accelerate key process iterations and transition smoothly to mass production, Manz Asia plays an active role in the global RDL processing and panel-level packaging supply chain.Designed for next-generation advanced packaging technologies like CoPoS, FOPLP, and Glass Core TGV, the debut of the Omni series production systems helps customers accelerate their transition from R&D validation to mass production. To learn more about Manz Asia production systems and product offerings, please visit the booth M1248, 4th Floor, Hall 1, Nangang Exhibition Center at SEMICON Taiwan 2026. You can also view detail product information on the official website.