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REALTIME NEWS
AI chip scaling shifts into 3D, with performance per watt the new benchmark, says former TSMC VP
Semiconductors
18min ago
Toppan, Keio University validate quantum AI image generation
ICT
26min ago
Samsung faces delays securing 2nm customers as 4nm capacity reaches full utilization
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Advanced PCB drilling faces growing demand from AI and high-speed applications
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Tomorrow's Headlines
Oct 20, 18:51
China’s RISC-V targets servers as XuanTie chip shipments exceed 6 billion
Tomorrow's Headlines
Oct 20, 18:51
DAMO Academy expands into autonomous driving and robotics with XuanTie processors
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Oct 20, 18:51
SDC advances MPO and inkjet-printed OLED in parallel
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Oct 20, 18:51
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COMPUTEX
Thursday 2 July 2026
TEAMGROUP Showcases self-destruct SSD amid AI memory boom
As the AI computing race accelerates and semiconductor manufacturing capacity is increasingly redirected toward advanced memory, the memory industry is shifting from price-driven competition to a battle over resource allocation and supply security...
Thursday 11 June 2026
Cincoze to Showcase Comprehensive Edge AI Solutions at Computex 2026
Rugged edge computing brand – Cincoze will showcase its latest embedded computing solutions at COMPUTEX Taipei 2026, from June 2–5 (Hall 2, Booth Q0401a)...
Monday 19 May 2025
COMPUTEX's Special Issue
Technology news, product launches and show highlights from the event attendees available for download (PDF).
LATEST STORIES
Wednesday 14 October 2026
Practical Insights & Industry Ideas
How can AI become more powerful and, at the same time, more energy-efficient? How is the electronics industry adapting to new cyber resilience requirements? And what is driving the All Electric Society forward? electronica 2026 provides answers to these questions not only in the exhibition area of its 18 exhibition halls, but also through its extensive supporting program...
Tuesday 13 October 2026
Chenbro unveils AI rack-level solutions at 2026 OCP Summit
Chenbro, a leading professional server chassis manufacturer, announced today its participation in the OCP Global Summit 2026, taking place from October 13 to 15 in San Jose, California...
Thursday 8 October 2026
Nuvoton, AMI Empower AI Factories Via Arbel NPCM8XX OpenBMC
As global AI infrastructure investments continue to accelerate, OEMs, ODMs, and hyperscale cloud providers are seeking secure, scalable, and production-ready OpenBMC platforms that can shorten development cycles and accelerate deployment...
VIDEOS
SEMICON Exclusive Interview|Powering the AI Era: The Role of Advanced Materials
SEMICON Exclusive Interview|Enabling Mass Production of Silicon Photonics & CPO for AI
SEMICON Exclusive Interview|Syensqo Unboxed: FFKM, Galden & Sustainable Polymers
Straight from SEMICON 2026|ZEISS, Henkel, Tescan, and camLine
Straight from SEMICON 2026|PBA Systems, Rigaku, and ABB
COMPUTEX Exclusive|PEGATRON’s NVIDIA Rubin Racks & Physical AI Explained
MULTIMEDIA
K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue
MOST-READ
7 DAYS NEWS
TSMC locks in 3-6% wafer out price hikes for 2027
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TSMC, Intel named as Musk's Terafab ambitions face reality check
GlobalFoundries wins US$2 billion TSMC interposer deal, closing a US packaging gap
Beyond 16 layers: HBM stacks test advanced packaging equipment makers
AI infrastructure faces four hurdles: Power, construction, technology, funding
Musk and Anthropic test rival models for sharing AI wealth with the public
Contrel, FSE combine laser and plasma processes for advanced packaging
Nvidia's Vera CPU signals a broader shift in AI infrastructure
Packaging-to-board integration emerges as key gap as AI reshapes electronics supply chain
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