Taipei, December 11, 2025: Dimerco Express Group ("Dimerco") has announced that it is strengthening its integrated, Asia-focused logistics solutions to help customers capture growth from AI and "Taiwan+, China+" manufacturing while managing risks from congestion, regulatory changes and shifting capacity

At COMPUTEX 2025, ASUS showcased its comprehensive AI infrastructure solutions, targeting the computing needs of data centers, edge computing, and a wide range of intelligent applications. With a robust product portfolio, ASUS brings to life the NVIDIA AI Factory vision, illustrating how AI will be deeply embedded into enterprise IT infrastructure. This evolution continues to drive forward applications and services that shape the future of AI and high-performance computing

Technology news, product launches and show highlights from the event attendees available for download (PDF).

ASUS today announced ASUS Optimized Liquid-Cooling Solutions and a strategic partner framework designed to address the escalating thermal, power, and density challenges of next-generation AI and high-performance computing data centers.ASUS Optimized Liquid-Cooling Solutions for next-generation AI compute densityAs AI and HPC workloads push compute density and power consumption beyond the capabilities of traditional air cooling, optimized liquid-cooling solutions by ASUS will provide the critical thermal management required for the next-generation NVIDIA Vera Rubin NVL72 system based data centers. By efficiently dissipating heat from high-performance CPUs, GPUs, and accelerator-dense racks, ASUS significantly reduces energy consumption, lowers PUE, and optimizes TCO while supporting unprecedented rack density.ASUS Optimized Liquid-Cooling Solutions offer a comprehensive portfolio spanning direct-to-chip (D2C), in-row CDU–based cooling, and hybrid configurations, enabled through collaboration with global infrastructure leaders. Leveraging a strategic framework of partners – including Schneider Electric and Vertiv, alongside precision components from Auras Technology, Cooler Master, and other industry leaders – ASUS provides purpose-built cooling solutions that ensure optimal stability and performance at scale. With 2,156 No. 1 SPEC CPU records and 248 No. 1 MLPerf results, ASUS continues to demonstrate leadership in real-world compute density and AI performance.Real-world deployment: ASUS powers liquid-cooled AI supercomputer at NCHCA flagship example of liquid-cooling expertise by ASUS is its recent deployment for the National Center for High-performance Computing (NCHC) in Taiwan. The system features a dual-compute architecture, including the Nano4 NVIDIA HGX H200 cluster and NVIDIA GB200 NVL72 system  -  Taiwan's first fully liquid-cooled AI supercomputer deployment of this architecture.Designed and engineered by ASUS from the ground up, the system implements direct liquid-cooling (DLC) technology to achieve an exceptional power-usage effectiveness (PUE) of just 1.18. This deployment seamlessly integrates high performance with sustainable design, demonstrating the strength of ASUS in thermal and energy management for large-scale AI infrastructure.Join ASUS at GTC 2026ASUS announced its participation as a Diamond Sponsor (Booth #421) at NVIDIA GTC 2026 from March 16–19 in San Jose, USA. Under the theme Trusted AI, Total Flexibility, ASUS is collaborating with NVIDIA and global infrastructure giants to showcase a robust, next-generation liquid-cooling ecosystem. Come explore with us and witness the next evolution of AI infrastructure.

Tong Hsing Electronic, a global leader in semiconductor assembly and testing services, today announced a strategic collaboration with Singapore-based AI solutions provider SixSense, following a comprehensive market evaluation. The partnership aims to advance Tong Hsing's smart factory initiatives, with an initial focus on AI-driven defect classification (ADC) in manufacturing processes.As semiconductor manufacturing becomes increasingly complex and high-volume, traditional manual defect inspection and classification methods face growing challenges in terms of labor cost, consistency, and efficiency. After evaluating multiple solutions, Tong Hsing Electronic selected SixSense for its strong performance in classification accuracy, deployment flexibility, and seamless integration with existing production systems - aligning closely with the company's long-term digital transformation and smart manufacturing strategy.By adopting SixSense's AI-powered ADC solution, Tong Hsing Electronic look forward to automatically analyzing and classifying large volumes of defect images generated across production lines. This significantly reduces reliance on manual inspection, improves classification consistency, accelerates cycle time, and enables engineering teams to identify and address process issues more effectively.Skid Chiu, Senior Assistant Vice President of Tong Hsing commented:"Reducing labor-intensive steps while maintaining quality is critical for sustainable growth. The adoption of SixSense's AI ADC solution is expected to enable us to optimize resources more effectively while keeping pace with increasing inspection demands."Akanksha Jagwani, Co-Founder & CEO of SixSense, added:"Our goal is to help semiconductor manufacturers scale operations without scaling complexity or cost. The results currently validated by Tong Hsing Electronic Industries also demonstrate how AI can simultaneously reduce labor dependency and improve cycle efficiency in high-volume manufacturing environments."Tong Hsing Electronic emphasized that this collaboration represents more than a system deployment - it marks a key milestone in its smart factory roadmap. Moving forward, both companies plan to deepen their collaboration by expanding AI applications across additional process stages and product lines, further strengthening manufacturing resilience and competitiveness.

QuiX Quantum, a leading provider of photonic quantum computing hardware, and Artilux, a developer of advanced semiconductor-based photonic detector technologies, today announced the signing of a Memorandum of Understanding (MoU).This agreement builds on the companies' complementary strengths in photonic system design and their positions within the broader semiconductor ecosystem. The collaboration is aimed at strengthening hardware integration, improving manufacturability, and lowering operational energy requirements in photonic quantum computing systems.Building quantum hardware for practical environmentsAs quantum computing matures into real-world applications, operating efficiently beyond specialized laboratory environments is becoming increasingly critical. The collaboration focuses on integrating advanced detector components more closely within photonic quantum hardware, enabling meaningful reductions in infrastructure demands. This direction contributes to quantum computing hardware that is increasingly compatible with modern data-center environments and designed with deployability and total cost of ownership in mind.Integration, scalability, and energy efficiencyBy combining Artilux's expertise on germanium silicon (GeSi) photonic technology with QuiX Quantum's system-level photonic quantum computing development, the collaboration seeks to simplify system architecture and reduce detector-level cooling requirements and support infrastructure. This approach improves overall manufacturability and supports QuiX Quantum's objective of delivering high-performance photonic quantum computing hardware in Data Centers and HPC infrastructure, enabling scaling with industry needs.Executive Quotes:Dr.-Ing. Stefan Hengesbach, CEO, QuiX Quantum "We are thrilled to partner with Artilux as this collaboration supports our long-term strategy of building scalable and most energy-efficient photonic quantum computers. This allows us to improve manufacturability, uptime and reduce operational complexity while further expanding practical deployment."Erik Chen, CEO, Artilux "We are excited to collaborate with QuiX Quantum on leveraging our detector technologies to advance and support more energy-efficient and scalable quantum hardware. Partnerships like this help accelerate progress in next-generation photonic computing and underscores our growing role in global deep-tech innovation across multiple industrial sectors."Bas Pulles, Representative of Netherlands Office Taipei "We are pleased to witness the signing of this agreement between two technology pioneers; this agreement exemplifies how international cooperation can accelerate breakthrough technologies and create long-term economic and technological value for both regions."