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Tuesday 25 August 2026
CYP Launches 4K60 Seamless Matrix Switcher to Simplify Multi-Source Operation
As the number of video and information sources in today's workplaces continues to grow, small control rooms, meeting rooms, and multimedia environments often need to connect multiple computers and other AV sources while displaying different types of content across multiple screens. Although conventional devices can switch between video sources, simultaneously displaying multiple sources, adjusting display layouts, and operating different computers often requires several separate devices. This not only takes up additional space but also makes daily operation more complicated
Tuesday 25 August 2026
Conquer Advances Circuit Protection for AI Power With 50 Years of Expertise
As the power demands for AI servers and racks continue to rise, data center power architectures are moving toward higher voltages and greater power densities. Ryan Chiu, Vice President of Conquer Electronics, noted that the rapid expansion of AI infrastructure is not only reshaping server and power system designs, but also raising the bar for circuit safety and long-term reliability.Ben Sung, Field Application Engineer (FAE) in Conquer's Sales and Marketing Division, explained that conventional AC/54V DC power architectures are increasingly constrained by rising power demands. As a result, the industry is moving toward high-voltage DC (HVDC) architectures, including ±400V and 800V systems. By increasing voltage, these architectures can reduce current and transmission losses, but they also place greater demands on circuit protection components. Fuses must therefore deliver higher DC voltage ratings, greater DC interrupting capability, lower demand loss, and enhanced reliability.Approaching its 50th anniversary, Conquer is extending its nearly five decades of expertise in circuit protection to emerging applications such as AI data centers and high-power power supplies. In response to the evolving power architecture landscape, the company continues to invest in the development of next-generation fuse technologies, expanding its high-power product portfolio while strengthening partnerships with customers across the AI and power infrastructure markets.Designing fuses for high-voltage, high-current, and high-temperature environments requires careful consideration of multiple factors, including materials, fuse-element structure, arc suppression, thermal management, and long-term aging. Sung noted that, depending on the application, fuses can be deployed at the output of power supplies, at the input and output of battery backup units (BBU) and power capacitance shelf (PCS), and at the output of power distribution units (PDU).Unlike circuit breakers or electronic protection devices, fuses require no external power or control. In high-voltage DC systems, they can rapidly and safely interrupt current in the event of a short circuit, even when fault currents reach several thousands of amperes, while working alongside other protection components to provide multiple layers of circuit protection.At the same time, the limited space inside AI servers requires fuses to withstand higher voltages and currents in increasingly compact form factors. This makes miniaturization, high current-carrying capacity, high interrupting capacity, and long-term reliability key considerations in fuse design.To address these requirements, Conquer Electronics incorporates simulation software early in the R&D process to analyze fuse-element characteristics, thermal stress distribution, and structural performance. By identifying temperature-rise and heat-dissipation risks before physical prototyping, and combining simulation with material testing, the company can streamline the product development process.The ACF and KBF series are examples of Conquer’s high-performance fuse solutions. Both offer a breaking capacity of up to 30kA, with the ACF measuring 7×32mm and the KBF measuring 10×32mm. The compact designs address the demands of high-power systems for space efficiency, high current-carrying capacity, and reliable circuit interruption.As AI product development cycles become shorter, Conquer is also engaging with customers earlier in the design process, helping them select the appropriate fuse base on operating voltage, current, ambient temperature, and available space. When standard products cannot meet specific requirements, the company can proceed with customized development.Chiu noted that customers today look beyond specifications and pricing, placing increasing emphasis on join development and speed to market. With UL and TÜV witnessed laboratories, Conquer can help shorten the safety certification process for customized products, bringing simulation, prototyping, validation, certification, and mass production into closer alignment with customer project timelines.This end-to-end capability, spanning R&D, testing, and mass production, is backed by nearly five decades of technical expertise at Conquer Electronics. Founded in 1977, the company has developed products for a wide range of markets, including household appliances, 3C electronics, mobile devices, and compact power supplies. Chiu stated that the firm's long-standing expertise in materials, manufacturing processes, testing, safety certifications, and automated mass production provides a strong foundation for expanding into high-power applications such as AI data centers.In materials and structural design, for example, Conquer has developed a patented alloy wire and integrated terminal design to replace conventional lead-based soldering. This approach reduces the risk of material fatigue caused by prolonged exposure to high temperatures while also reducing the use of hazardous substances.Chiu noted that when global customers evaluate suppliers, they look beyond product performance to factors such as joint development capabilities, certification lead times, mass production capacity, and supply reliability. In recent years, Conquer has invested in smart manufacturing and digitalized supply chain management. The company uses robotic process automation (RPA) to manage orders and has implemented ERP systems that connect its internal manufacturing execution system (MES) with customers'material requirements planning (MRP) systems, improving production scheduling and delivery visibility.ESG considerations are also integrated into Conquer’s daily operations and product development. The company has implemented energy management and greenhouse gas inventory systems, undergoes annual third-party audits, and regularly publishes sustainability reports. On the R&D side, product miniaturization and integrated structural designs help reduce material and energy consumption.Chiu said Conquer has long embraced the business principles of “Integrity and Quality, Excellence and Innovation, and Resource Conservation.” The principle of “Resource Conservation” extends beyond operations to product design and sustainable business practices. This R&D approach, centered on reliability and resource efficiency, is also becoming an important foundation for Conquer’s expansion into a broader range of high-power applications.As high-power applications continue to expand, circuit protection requirements vary across industries. Chiu noted that AI data centers place a strong emphasis on heat dissipation within space-constrained environments and long-term thermal stability. Electric vehicles (EV) must withstand driving vibrations, extreme temperatures, and material fatigue while meeting stringent automotive-grade requirements. Energy storage systems, which are often installed outdoors for extended periods, place greater emphasis on weather resistance, reliability through frequent charge and discharge cycles, and long service life.Looking ahead to the next 50 years, Chiu said Conquer Electronics will remain focused on its core mission of “providing circuit safety” and evolve into a “co-creation partner for circuit safety,” working alongside customers to solve challenges and expanding its collaboration across AI, energy storage systems, EVs, and other high-power applications.At the same time, Conquer will continue to build long-term trust through its commitment to “Integrity and Quality,” serving as a reliable supply chain partner for customers worldwide as they address increasingly stringent reliability requirements. Guided by its principle of “Resource Conservation," the company will also continue to reduce energy and material consumption throughout technology and product development. Circuit safety, supply chain resilience, and sustainable operations will serve as the three strategic pillars guiding Conquer’s next stage of growth.Conquer VP Ryan Chiu says 50 years of circuit protection expertise now covers AI, EVs, and LEOS.Credit: DIGITIMES
Tuesday 25 August 2026
CYP Launches 4K60 Seamless Matrix Switcher to Simplify Multi-Source Operation
As the number of video and information sources in today's workplaces continues to grow, small control rooms, meeting rooms, and multimedia environments often need to connect multiple computers and other AV sources while displaying different types of content across multiple screens. Although conventional devices can switch between video sources, simultaneously displaying multiple sources, adjusting display layouts, and operating different computers often requires several separate devices. This not only takes up additional space but also makes daily operation more complicated.To meet the growing demand for multi-source video integration and simplified operation, CYP has introduced a new 4K60 seamless matrix switcher (model number: CPLUS-V4H2HUSB). In addition to routing any of the four AV sources to two displays, the matrix switcher allows users to arrange all four sources in Picture-in-Picture (PiP), Picture-on-Picture (PoP), or quad-view layouts. Users can operate connected computers through a single keyboard and mouse, while the on-screen windows can be repositioned and resized simply by dragging them with the mouse. As a result, multi-window layouts can be configured more intuitively and adapted to specific operational needs.The matrix switcher features two HDMI inputs and two USB Type-C inputs for connecting desktop computers, laptops, and other video devices. Two HDMI outputs support connections to two displays, with resolutions of up to 4K@60Hz 4:4:4 for clear, high-quality video.In matrix mode, users can switch seamlessly between video sources without the displays temporarily going black while the signal is being re-established. This ensures uninterrupted operation during system control, meetings, and video presentations. In addition to controlling multiple computers with a single keyboard and mouse, users can resize and reposition PiP windows by dragging them with the mouse, making multi-window operation as intuitive as rearranging windows on a computer desktop.Both USB Type-C inputs support video, USB data, and network connectivity while providing up to 45W and 30W of power delivery, respectively. With a single USB-C cable, users can quickly connect a laptop to the system to transmit video, access the keyboard and mouse, connect to a wired network, and receive power at the same time. The matrix switcher can also be controlled through its front-panel buttons, a mouse-operated on-screen display, Ethernet, or RS-232, allowing it to be used as a standalone device or integrated into an existing meeting room or control system.In a small control room, operators can combine live video, system status, data, and alarm notifications within a single display layout. The main window can be used for content that requires continuous attention, while smaller windows display supporting information. Alternatively, a quad-view layout can be used to monitor four sources simultaneously. With a single keyboard and mouse, operators can access and control different systems. When the cursor moves over a specific window, that window is highlighted with a border, helping operators confirm which system is currently active and reducing the possibility of errors when working across multiple systems.In meeting room applications, the matrix switcher can integrate presentations, video conferencing, participant feeds, and real-time data into a single viewing environment. For example, presentation content can be shown in the main window, while additional windows display remote participants, meeting materials, or reference information relevant to the discussion. Users can enlarge the content currently under discussion by dragging and resizing its window or reposition different sources to create a more suitable layout. When multiple types of information need to be viewed simultaneously, users can switch to a side-by-side or quad-view layout, reducing the need to repeatedly switch between sources.For multimedia and video presentation applications, the four video sources can be arranged in different layouts according to content and production requirements. This makes the matrix switcher suitable for live events, video monitoring, training sessions, product demonstrations, and corporate information displays. During a live event, for instance, the speaker, presentation materials, camera feed, and event information can be combined within a single layout. Likewise, production and monitoring teams can view multiple video sources simultaneously and quickly reposition or resize windows with the mouse as the event progresses or content priorities change.As video and information sources continue to increase, users need more than additional displays. They also need the flexibility to reorganize information for different scenarios and quickly access multiple systems. By combining dual-display 4K outputs, flexible multi-window layouts, drag and resize operation, seamless switching without black screens, and single keyboard and mouse control, CYP helps small control rooms, meeting rooms, and multimedia environments create clearer, more flexible, and more efficient video integration workflows.Multi-view Display For Conference. Credit: Cypress Technology
Monday 24 August 2026
iCometrue to Showcase Glass-Based AI Multichip Packaging Solutions at SEMICON Taiwan 2026
Interested in solving microcrack issues in through-glass via (TGV) fabrication? Want to learn how to supply 1,000 Watts, 1 Volt and 1,000 Amperes electricity to semiconductor IC chips in an AI multichip package while scaling up glass panel sizes? If so, visit iCometrue at Booth M0957, Hall 1, 4F, Taipei Nangang Exhibition Center during SEMICON Taiwan 2026!Glass substrates have emerged as a promising platform for large-size, high-performance AI multichip packages due to their superior thermal, mechanical, and electrical properties. At SEMICON Taiwan 2025 last year, iCometrue exhibited the Through-Polymer-Via (TPV) Connector, a novel technology that provides vertical interconnection in Glass Cores for use in Glass Interposers and BGA substrates to solve the microcrack problem in glass substrates caused by TGV fabrication.At SEMICON Taiwan 2026 this year, iCometrue plans to exhibit solutions for delivering 1,000 Watts, 1 Volt and 1,000 Amperes electricity to semiconductor IC chips in the high-performance AI multichip package. The solutions include:1. Embedding Cu blocks in glass substrates for power/ground delivery: Reducing the number of TPVs/TGVs originally used for power/ground delivery by 80%, thereby lowering fabrication complexity, improving manufacturing yield, and reducing manufacturing costs.2. Packaging Voltage Converter/Regulator (VCR) chips in the AI multichip package: Allowing high-voltage (for example, 48V) power supply input to the package and reducing power supply voltage (for example, down to 1V) within the package, based on the copper-block-based low resistance power delivery system. The innovated copper-block-based low resistance power delivery system reduces the heat generation.3. Embedding Si bridges, deep-trench decoupling capacitors (DTCs), and Voltage Converter/Regulator (VCR) chips in the frontside interconnection scheme over the glass substrate: Silicon bridges, DTCs, and VCR chips are embedded directly into the frontside interconnection scheme over the glass substrate, leaving large holes in the glass substrate dedicated to TPV connectors and copper blocks to streamline manufacturing.4. Installing electrical/optical connectors at the edges of the AI multichip package: This architecture uses electrical and/or optical connectors at the package edges for power and signal input/output, replacing the conventional power and signal routing that traditionally relied on bottom solder balls. This unleashes a TPV/TGV-free System-on-Panel (SOP) package, allowing thicker glass substrates that drastically reduce panel bending and enable larger manufacturing panel sizes.By using innovations mentioned above, iCometrue provides a scalable, practical alternative to traditional TGV processes. These breakthroughs extend Moore's Law into the era of glass-based system packaging, accelerating high-performance computing (HPC) and AI applications.