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Tuesday 6 January 2026
MSI Unveils Full Lineup of AI Products at CES 2026
MSI, a world leader in gaming and high-performance AI computing, today announced its commanding presence at the 2026 Consumer Electronics Show (CES), centered around the theme of "Innovate Beyond.
Tuesday 13 January 2026
AGI Advances AI-Ready Next-Gen Storage Layout at CES 2026
AGI Technology, the innovative Taiwanese memory brand, has successfully concluded its showcase at CES 2026. Located at Bellini 2001B in The Venetian Resort, Las Vegas, AGI presented its next-generation high-speed and mobile storage solutions under the theme "Powering What's Next with AGI Innovation", attracting interest from global brand partners, system integrators, and professional creators.With the rapid proliferation of AI in PCs and mobile devices, the demand for high-resolution media, real-time content generation, and edge AI applications has been surging. AGI emphasizes that storage is no longer just about capacity; it has become a critical factor determining system performance, bandwidth, mobility, and reliability.The AGI President, Miranda Lee, stated, "High-speed and high-capacity storage are now a market baseline. The differentiator lies in aligning solutions with real-world usage scenarios and maintaining consistent supply and quality. In the fast-changing AI era, AGI continuously adapts its product strategy and brand positioning to meet market expectations for practical usability."CES 2026 Product Highlights: Empowering High-Performance ComputingTo support the demands of AI and high-performance applications, AGI showcased its complete next-generation storage lineup, focusing on high-performance platforms and mobile usage:1.PCIe Gen5 SSD (Project S10): Designed for intensive workloads, delivering top-tier performance while managing power consumption and heat dissipation for sustained stability.2.DDR5 Overclocking Memory (Project K10): Engineered for AI-driven platforms and high-end gaming, offering extreme bandwidth to handle complex, high-speed data processing, ensuring stability.3.Portable SSD Series: Tailored for mobile content creation and outdoor professionals, the PSSD series emphasizes durability and high-speed transfer to ensure creative work and memories are quickly and securely preserved.A User-Centric Approach for Global MarketsThe AGI President Miranda Lee further noted that AI not only accelerates the capacity demands but also reshapes how data is accessed and transferred, making portable storage essential to modern creative workflows. Rather than competing solely on technical specifications, AGI focuses on user scenarios, integrating long-term value and stability into the product design. During CES, AGI engaged in in-depth technical and market discussions with global partners, strengthening its international distribution network through its precise product roadmaps.  Looking Forward: Stability and Practicality at the Core of the BrandCES 2026 served as a pivotal milestone for AGI's expansion. Moving forward, AGI will continue investing in high-speed interfaces and performance optimization, ensuring its products deliver outstanding stability in real-world scenarios, staying true to the brand promise: Preserve Your Uniqueness.AGI is a leading provider of high-performance storage solutions, dedicated to delivering innovative products that cater to the evolving needs of its customers. With a commitment to offering cutting-edge storage capacity and superior performance, AGI empowers users with reliable solutions for an enhanced digital experience.AGI GR0NNLUX 10K showcased DDR5 Overclocking RGB Memory Module. Credit: AGITechnologyAGI's booth saw a steady stream of visitors, highlighting strong market interest. Credit: AGI TechnologyAGI's booth saw a steady stream of visitors, highlighting strong market interest. Credit: AGI Technology
Tuesday 13 January 2026
HQ Pack ?? global full-service provider of high-tech packaging from design to reuse
HQ Pack is a global leader in high-tech packaging solutions. The company is expert at designing, producing, (precision) cleaning, and making packaging solutions reusable again after use, as well as manage the packaging logistics of high-quality industrial products. They do so for clients in the semiconductor and other high-tech industries. The process procedures and packaging solutions ensure the parts, modules or components of highly sophisticated equipment are fully protected during transportation and logistical arrangements. And at the same time, the system will meet the customer demand for protection of valuable products during transit while adhering to environmental, social, and governance (ESG) principles. The packaging design incorporates features like sustainable materials, waste reduction strategies, and carbon footprint minimization, alongside ensuring the integrity of high-value goods through robust physical protection. The company provides complete packaging solutions, starting with the development and sourcing of customized packaging materials. HQ Pack's regional Service Centers ensure that reusable packaging materials are ready to use again by cleaning and repairing them to like-new condition. They can also support reuse of parts by harvesting them before scrapping for new build packaging. If there is material destined for waste management, HQ Pack supports this at the same time.Because most of its high-tech clients operate on a global scale, HQ Pack operates not only at its headquarters in Eindhoven, the Netherlands, but also in Johor and Penang in Malaysia, Taiwan, Singapore, Germany, and in the United States (locations in Brookfield (CT), Newark (CA), and San Diego (CA)) providing the same quality and service at each location. With their Service Centers they support both their customers' sustainability goals as well as their own. Their slogan "We Create to Protect" is exactly what they do. The high-quality packaging solutions ensure that valuable and fragile products, modules, components and/or parts can be safely transported worldwide. With over 40 years of experience and global presence, no compromission on quality, flexibility at the heart of our organization, they are a full-service provider with fast, reliable and sustainable packaging solutions.
Friday 9 January 2026
Taiwan III launches national team to deliver DCBBS computer cabinet
Generative AI is fueling accelerated growth in worldwide computing power requirements, yet the industry encounters significant challenges. Although the product cycle for GPUs and AI servers has been condensed to approximately 18 months, the conventional data center construction process remains at two to three years, resulting in a structural gap where the deployment of computing capacity lags behind technology advancements.Supermicro, in collaboration with Easy Field Corporation (EFC) and Chicony Power, has unveiled the world’s first containerized compute solution built on Data Center Building Block Solutions (DCBBS). This solution is designed to expedite engineering delivery timelines and offers an alternative approach to the construction of AI infrastructure. Originally developed by Supermicro, DCBBS is a comprehensive, modular data center architecture aimed at accelerating large-scale compute deployments.In this DCBBS solution, Taiwan's Institute for Information Industry (III) acts as a coordinator for industry integration, connecting resources from IT, infrastructure, engineering consulting, and manufacturing to ensure that all stakeholders comply with a unified delivery timeline.Wang Rui-min (transliterated from Chinese), Senior Strategy Director of the Market Intelligence & Consulting Institute (MIC) at III, explained that AI computing power initiatives involve various components and parts, such as servers, networking devices, power supplies, cooling infrastructure, structural engineering, testing procedures, and international certifications. Historically, inadequate coordination methods often led to asynchronous delivery within these categories.Simon Hsu, COO of Taiwan's National Applied Research Laboratories (NARLabs), observed that traditional data center construction methodologies are inadequate in accommodating the progress of AI technology. Computing power has become a crucial resource for scientific research and industrial development, with the speed of deployment significantly impacting the evolution of both research and applications. In this context, modular and rapidly replicable computing power supply models are garnering attention.The DCBBS solution, collaboratively developed by Supermicro and several Taiwanese manufacturers, utilizes a methodical design approach. It first develops the overall data center architecture, then deconstructs tasks such as power supply, cooling, networking, fire safety, and administration into modular components.Huang Shih-chin (transliterated from Chinese), Product Manager for Supermicro's Rack Solutions, stated that this solution explicitly demonstrates computing power density in its technical specifications, addressing the requirements of various GPU generations, and introduces the notion of "Container Scale," enabling the expansion of computing power on a container-by-container basis. The engineering design prioritizes uninterrupted water, electricity, and network connectivity.The generator, transformer, chiller, and UPS are arranged in a containerized configuration, equipped with wireless environmental control and remote monitoring systems, facilitating mobility and rapid deployment of the computing units. The container is designed according to weight, stress absorption, external circumstances, and transportation certification standards, rather than conventional container specifications. The test line construction and burn-in verification have been completed, and the DCBBS system has entered the final acceptance and shipment phase.In the DCBBS project, EFC used an engineering methodology to complete system integration tasks for computing resource deployments. Chairman Paul Luo stated that, while AI servers are expensive, the primary elements determining computing power competitiveness are deployment timeframes and engineering dependability; delays or system failures result in expenditures that much surpass hardware expenses. Thus, EFC used a modular approach to organize the structural design, vibration mitigation, transportation, and certification requirements for the outdoor installation of large, high-density equipment in atypical environments, before transferring these components to the factory for assembly and verification. Luo indicated that, moving forward, computing containers will primarily be deployed in areas rich in energy resources.Consequently, what is truly finite is not electricity itself, but the ability to swiftly replicate and maintain the level of engineering execution. EFC, possessing extensive expertise in the production of large-scale structures and high-reliability systems, ensures that its computer cabinets are thoroughly prepared for acceptance and delivery before shipment. They are considered the fundamental framework and structure of the entire computing center, enabling future expansion within a managed and foreseeable technical timeline.In terms of work division, Supermicro is in charge of coordinating the full rapid delivery process, drawing on its significant experience with high-density computing clients. In recent years, the company has obtained AI processing power contracts, including those from Tesla, gaining engineering experience in high-density configurations and fast delivery, which has become a critical basis for minimizing deployment delays. Chicony Power oversees the wireless environmental control system, employing sensors, digital twins, and remote-control technology to mitigate the effects of conventional extensive cabling on deployment efficiency, hence facilitating expedited scheduling and replication of computing cabinets.EFC monitors the structural engineering design and, using its expertise in ship door manufacture, has ensured the structural integrity, vibration mitigation, and marine certification compliance for large, high-density equipment employed in outdoor settings. On the power infrastructure side, a modular Power Interface Unit (PIU) developed under the Taiwan Busway (TBC) project enables flexible and scalable power configuration. Sinotech Engineering Consultants also contributed to the end-to-end planning of JBL’s large-scale computing center in Indonesia. Overall, the DCBBS-based initiative has now entered the active implementation phase.Hsieh Chieh-shou (transliterated from Chinese), a director on Viscor Computing's board, stated that the DCBBS project is not intended as a conceptual demonstration but as an engineering solution based on the principles of deliverability and replicability.Unlike other teams that are still engaged in architectural design and strategic planning, the DCBBS project, led by Supermicro, EFC, and Chicony Power, has completed the setup of operational test lines, which include physical equipment integration, power configuration, and burn-in verification, and is ready to advance to the replication and delivery phase. As this model evolves, the team has been emulating the collaborative strategy of "national second-tier teams," thereby broadening the participation of Taiwanese firms possessing engineering and manufacturing expertise. This enables the metal and electromechanical sectors, which have faced challenges due to shifts in the global industrial landscape in recent years, to venture into computing infrastructure and pursue an additional transformation opportunity.Wang noted that the delivery approach of the DCBBS project offers significant advantages for implementing enterprises in both financial and engineering aspects. In engineering, factory modularization and pre-integration—including wiring, labeling, performance verification, and burn-in testing—conducted prior to shipment can substantially diminish the uncertainty and risk associated with repeated modifications during onsite construction abroad. Financially, acceptance and payment can come quickly after testing, shortening the project payback period and reducing foreign deployment and travel costs. He stated that this design allows computing power efforts to evolve into a business model with predictable delivery and cash flow patterns, rather than long-term investment ventures with low returns.Building on this foundation, the DCBBS project has evolved from a single compute cabinet into a sustainably scalable, modular system architecture. The team will subsequently release modules pertaining to generators, transformers, UPS, chiller units, control rooms, and coatings, while including a new 800V DC power architecture and cooling-in-rack design to improve the overall system's integrity and adaptability. Essential technical tasks, such wiring, labeling, integration, and testing, are consistently performed in Taiwan, thereby mitigating the unpredictability of international construction and expediting acceptance and payment processes. Wang emphasized that the core value of the DCBBS initiative lies not only in improving engineering and financial efficiency, but also in retaining the majority of high value-added integration and verification work in Taiwan, laying a sustainable foundation for long-term industrial competitiveness in the AI era.Taiwan-built DCBBS delivers deployable, scalable compute architecture. Credit: Easy Field Corporation