NewPower Worldwide, one of the electronics industry's fastest-growing distributors, today announced it has expanded its committed credit facility to $750 million, further enhancing its ability to invest in inventory, support customer growth, and capitalize on opportunities across the global supply chain.The increase follows a period of exceptional growth for NewPower Worldwide. Since its founding in 2014, the company has rapidly expanded its global footprint, growing to 14 offices across the Americas, EMEA, and APAC, with $5 billion in annual sales, and managing more than $1 billion in inventory worldwide. The expanded facility provides additional financial capacity to support continued growth and evolving customer requirements.In today's rapidly changing supply chain environment, financial strength and access to capital play a critical role in securing inventory and maintaining continuity of supply. The expanded facility enhances NewPower's ability to purchase strategically, support large-scale customer requirements, and provide greater flexibility around inventory and delivery programs."Our customers rely on NewPower to solve supply chain challenges quickly and at scale," said Carleton Dufoe, Chief Executive Officer of NewPower Worldwide. "Expanding our credit facility to $750 million gives us additional capacity to secure inventory, support larger strategic programs, and respond faster when opportunities arise across the market. It further strengthens our ability to deliver solutions that help customers succeed in any market environment."The expanded facility strengthens NewPower's ability to support larger and more complex customer programs while increasing the volume and scale of transactions the company can execute globally. By increasing its purchasing capacity, NewPower is better positioned to secure strategic inventory, capitalize on market opportunities, and deliver supply solutions to customers with greater speed, flexibility, and scale."Our expanded partnership with NewPower reflects our confidence in the company as it executes on behalf of its clients," said Jason Upham, Senior Vice President at Citizens. "Our banking team led an increased credit facility designed to support NewPower's goals and growth objectives."The expanded facility reflects NewPower's continued financial strength and enhances its ability to convert market opportunities into tangible supply solutions for customers worldwide. Combined with the company's global sourcing network and supply chain expertise, the added capacity positions NewPower to execute larger programs, secure critical inventory, and help customers respond to changing market conditions with speed, flexibility, and confidence.

Tescan will participate in SEMICON Taiwan 2026 from September 2 to 4 at Booth R8201, 4F, Taipei Nangang Exhibition Center Hall 2 (TaiNEX 2). Under the theme "Streamlined Failure Analysis for Advanced Packaging," Tescan will present a correlative workflow that connects defect localization, rapid access to regions of interest (ROIs), site-specific sample preparation, and nanoscale characterization.Chiplet architectures, heterogeneous integration, advanced packaging, high-bandwidth memory (HBM), and wide-bandgap power devices are increasing structural complexity and introducing more diverse material stacks. As critical defects are often buried within packages or devices, failure analysis (FA) laboratories need an efficient end-to-end workflow that preserves sample context from non-destructive inspection through root-cause analysis.From Defect Localization to Nanoscale AnalysisTescan structures the workflow across four stages: Inspect, Access, Prepare, and Analyze. Tescan UniTOM HR 2 micro-CT provides non-destructive 3D imaging of internal package structures, warpage, and potential defects. Tescan FemtoChisel then uses gas-assisted femtosecond laser processing to expose buried ROIs, followed by precise cross-sectioning and sample preparation with Tescan SOLARIS X 2 plasma FIB-SEM under real-time SEM guidance. Tescan TENSOR 4D-STEM completes the workflow with nanoscale structural and materials characterization.By maintaining defect location and sample context across successive stages, the integrated workflow reduces repeated localization, rework, and unnecessary sample transfers. This helps R&D, process engineering, yield enhancement, and high-volume manufacturing (HVM) teams shorten time-to-answer and improve confidence in analytical results.Femtosecond Laser Processing Accelerates Workflows for Large, Complex SamplesDesigned for semiconductor sample preparation and failure analysis, Tescan FemtoChisel supports cross-sectioning, decapsulation, delayering, cavity preparation, and large-volume material removal. Gas-assisted femtosecond laser processing increases throughput while preserving the structural integrity and surface quality required for downstream high-resolution SEM, FIB-SEM, or TEM/STEM characterization.FemtoChisel Forum Presentation: From Hours to MinutesOn 2026, September 4 from 15:05 to 15:30, Hervé Macé, Semiconductor Solution Sales Development Director at Tescan, will present at the Semiconductor Advanced Inspection and Metrology Forum in Room 402 on the fourth floor of TaiNEX 1.Tescan FemtoChisel: From Hours to Minutes: High-Throughput Gas-Assisted Femtosecond Laser Workflows for Advanced Semiconductor Analysis and CharacterizationThe presentation will highlight how gas-assisted femtosecond laser processing accelerates sample preparation for large structures and complex material stacks while maintaining the quality required for downstream high-resolution characterization.Explore the Workflow at Booth R8201Tescan will host SPIN. MATCH. ENJOY. at Booth R8201 from 10:00 on 2026, September 2 and 3. Visitors can match Tescan technologies with their signature drinks while learning how non-destructive inspection, laser-based ROI access, and FIB-SEM sample preparation work together. Tescan specialists will also be available to discuss real-world failure analysis challenges and application requirements. Learn moe about Tescan at SEMICON Taiwan 2026 here.

Global technology and innovation leader ASMPT will showcase its advanced packaging portfolio at SEMICON Taiwan 2026, taking place from September 2 to 4 in Taipei. At Booth L0716 (TaiNEX 1, Level 4). ASMPT will be presenting technologies supporting next-generation AI, High-Performance Computing (HPC), Co-Packaged Optics (CPO) and photonics applications under the theme "Empower the Intelligence Revolution."  Reflecting its continued commitment to Taiwan, one of the world's leading semiconductor hubs, ASMPT is also strengthening its local leadership and customer engagement capabilities.Taiwan remains a key center for semiconductor innovation and advanced packaging. Working closely with customers across the region, ASMPT supports the industrialization of next-generation semiconductor technologies, helping bring advanced concepts into reliable, high-volume manufacturing and enabling the innovations that power the AI era.As part of its continued investment in Taiwan, ASMPT appointed Johnny Fan as General Manager, Country Head & Head of Sales, Semiconductor Solutions Taiwan, further strengthening its local leadership and customer support."Taiwan is at the forefront of semiconductor innovation, particularly in advanced packaging technologies that are enabling the AI era," said Johnny Fan. "Our customers are driving some of the world's most advanced semiconductor innovations in AI, HPC and photonics. The challenge is turning those innovations into production-ready solutions at scale, and that's where ASMPT helps its customers succeed."As AI applications continue to drive demand for more powerful and efficient semiconductor architectures, advanced packaging is playing an increasingly important role in delivering the required performance, power efficiency and integration. At SEMICON Taiwan 2026, ASMPT will present solutions supporting applications in HPC, AI accelerators, silicon photonics and Co-Packaged Optics (CPO), leveraging technologies such as Thermocompression Bonding (TCB) and Hybrid Bonding.As an example of these capabilities, ASMPT will showcase its MEGA multi-chip bonding solution. MEGA combines high-precision placement with alignment accuracy of ±2μm and ±0.1°, integrated epoxy dispensing and stamping capabilities, parallel processing of multiple adhesive materials, immediate UV fixation and integrated 3D inspection of the adhesive application. Independently operating pick and bond arms, together with a flip-pick unit and integrated rotation stage, enable flexible process execution for complex multi-chip and photonics applicationsJohnny Fan, ASMPT Taiwan Country Head, drives customer engagement & local ecosystem. Credit:ASMPT