As AI models and computing demands continue to grow exponentially, the biggest challenge in chip design is no longer pure processing power, but the bandwidth gap between processors and memory. Even with continuous improvements in processor performance, if data cannot be delivered in real time, overall system efficiency remains limited.To overcome this bottleneck, Die-to-Die high-speed interconnect and HBM4/PHY IP integration have emerged as critical technologies for next-generation AI and HPC chip designs.Progate Group Corporation(PGC), a member of the TSMC Design Center Alliance (DCA), leverages its ASIC turnkey expertise and participation in the Synopsys IP OEM Program to deliver advanced design capabilities comparable to leading international players-while offering a more cost-effective, high-value service model that helps global customers accelerate AI and HPC deployment and mass production.Technical Highlights: Comprehensive Support from Design to ProductionPGC provides one-stop technical services, supporting clients from chip design to production. The coverage includes high-speed interconnects, memory integration, foundry certifications, and AI/HPC application-oriented designs, helping clients shorten time-to-market efficiently.Die-to-Die Interconnect and Chiplet ArchitecturePGC offers advanced expertise in Die-to-Die interconnect and Chiplet-based system design, supporting 2.5D and 3D integration technologies to enable high-speed, low-latency, and low-power chip-to-chip communication. All solutions are compliant with the Universal Chiplet Interconnect Express (UCIe) standard, ensuring interoperability and scalability across heterogeneous and cross-supply-chain environments.This capability addresses the growing demand for high-bandwidth and flexible multi-die integration, empowering customers to build next-generation Chiplet-based systems with enhanced performance and modularity.HBM4 / PHY IP IntegrationLeveraging Synopsys-certified IP, PGC enables rapid integration of HBM4 memory and PHY interfaces to shorten design cycles while strengthening design reliability. These high-bandwidth memory solutions help design teams overcome data transfer bottlenecks and achieve terabyte-per-second (TB/s) throughput, meeting the stringent performance requirements of AI and high-performance computing (HPC) applications.TSMC DCA Certification AdvantageAs a certified member of TSMC's Design Center Alliance (DCA), PGC provides end-to-end design-to-tape-out support within the TSMC ecosystem. Customers can leverage TSMC's CyberShuttle multi-project wafer (MPW) program to conduct rapid prototyping and design validation, followed by seamless transition to mass production through PGC's ASIC turnkey services. All designs are fully compatible with advanced packaging technologies such as Wafer-on-Wafer (WoW) and 2.5D/3D integration architectures within major foundry ecosystems, ensuring a smooth and efficient path from prototype to production.AI / HPC Application FocusPGC's dedicated ASIC designs are optimized for AI and high-performance computing (HPC) applications, spanning AI accelerators, data center chips, and high-speed network switch devices. These designs support AI training, HPC simulation, and large-scale data processing workloads, meeting the performance, power, and scalability requirements of next-generation computing environments.Ecosystem IntegrationPGC's services are closely aligned with TSMC's advanced foundry ecosystem, combined with Synopsys-certified EDA and IP solutions, to deliver a complete ASIC turnkey flow covering: High-speed interface IP - ASIC design service - process support - packaging service - verification - testing - mass production.In addition to its own testing equipment and validation capabilities, PGC maintains long-term partnerships with multiple advanced test houses, enabling precise analysis for high-frequency, high-speed interface and advanced-node devices.This level of integration significantly reduces design risk and accelerates time-to-market, while ensuring that the design results are fully compatible with mainstream advanced packaging technologies - such as 2.5D/3D integration and wafer-on-wafer architectures within major foundry ecosystems - as well as international standards including UCIe.PGC delivers high reliability, low risk, and accelerated time-to-production through its comprehensive ASIC turnkey services, allowing customers to focus on differentiated design and market innovation. By leveraging its proven engineering expertise and established partnerships across the semiconductor supply chain, PGC helps customers reduce overall design and ASIC development costs, enhance design success rates, and improve product stability.In addition, PGC provides cross-regional engineering and project management support spanning Taiwan, Japan, China, and the United States - empowering global deployment strategies for AI and HPC applications with consistent quality and technical alignment.PGC provides complete ASIC turnkey services supporting 2.5D/3D advanced packaging technologies.Credit:PGC

As the global energy transition accelerates, AI applications are also rapidly expanding. From data centers and electric vehicle charging infrastructure to home backup power, demand for power supplies and energy storage is growing exponentially. Balancing high power output, energy efficiency, and intelligent management has become a shared challenge for the industry.Credit: MEAN WELLAt the 2025 Energy Taiwan and Net-Zero Taiwan, global standard power supply leader MEAN WELL, together with distributor partner Union Industrial Automation CORP., showcased a range of standardized power products. Based on real-world application needs, they integrated solar panels, lead-acid batteries, and other supporting equipment, combining inverters, chargers, bidirectional power supplies, and smart control modules into a total solution, highlighting MEAN WELL's product advantages as well as its localized, real-time service value.The NTN-5K off-grid inverter exhibited at the show integrates three key functions - charger, inverter, and UPS - into a single device, offering charging power exceeding 4kW and a peak instantaneous output up to 10kW. It can simultaneously handle AC charging, DC-AC inversion, and an uninterrupted power supply. Its applications range from homes and small commercial spaces to outdoor operations, and it can even serve as a temporary emergency power source for electric vehicles. With multiple protection mechanisms and conformal coating treatments, it ensures stable operation under harsh conditions. It also supports MODBus, CANBus, and other communication protocols, allowing users to remotely monitor and manage systems.Another featured product, the BIC-2200 bidirectional power supply, enhances energy usage efficiency. In traditional battery testing, discharge energy is often lost as heat. The BIC-2200, however, can feed this energy back into the grid with a conversion efficiency up to 93%, switching between charge and discharge in less than 1 millisecond. This reduces energy waste while enabling peak shaving, valley filling, and kinetic energy recovery, minimizing downtime risks caused by voltage surges. Its high-efficiency bidirectional conversion mechanism also makes it well-suited for the home energy storage market. Already implemented in European household energy storage cases, it demonstrates strong international market potential.Beyond industrial and process applications, MEAN WELL also introduced the ES-S1000 and ES-S2000 portable energy storage units for consumer use, with approximate capacities of 1kWh and 2kWh, respectively. Targeting home backup and outdoor leisure scenarios, these units support multiple charging modes, including grid, car, and solar charging, and provide AC outlets as well as USB Type-A and Type-C ports. Coupled with an intelligent battery management system, they offer protection against overcharge, over-discharge, short circuits, and high temperatures. Emphasizing "lightweight, plug-and-play" usability, they provide users with rapid access to power during outages or outdoor activities.To maximize system-level benefits, integrating key components requires technical service support. Willard Wu, Senior Engineer at MEAN WELL Technical Service Center, noted that the PV-ML solar controller showcased at the exhibition uses MPPT (Maximum Power Point Tracking) technology to automatically adjust output under varying sunlight conditions, improving battery charging efficiency by 20 - 30%. Supporting 12V - 48V battery systems, it offers broad applicability. When paired with NTN-5K or BIC-2200, it helps build a complete photovoltaic energy storage system, forming a critical part of smart energy solutions.In addition to standardized products, Union Industrial Automation CORP. Showcased an integrated setup of MEAN WELL inverters, chargers, bidirectional power supplies, and control modules at the exhibition. By combining these with third-party solar panels and lead-acid batteries, they created a display simulating a solar power plant, enabling visitors to quickly understand how MEAN WELL products work together in practical applications, forming a complete system of "energy generation, storage, inversion, and intelligent management."Tony Hsieh, Section Manager at MEAN WELL Technical Service Center, emphasized that these products, combined with localized technical support strategies, showcase MEAN WELL's differentiated solutions. Standardized products paired with local demonstration sites, allow users across industries to quickly understand applications and integrate them into existing systems. With globally certified products and localized distributor services, MEAN WELL meets international market demands while providing timely support. Furthermore, by focusing R&D on power and control products and leaving integration of batteries, solar panels, and supporting equipment to partners, the company enhances operational flexibility and promotes energy industry collaboration through "multi-party cooperation."Looking ahead, MEAN WELL is optimistic about AI and smart technology trends. Hsieh noted that AI applications are rapidly expanding into smart homes, wearable devices, industrial automation, and large-scale data centers, creating higher demands on power supply. MEAN WELL's diverse product lines can simultaneously support high-performance servers and edge AI devices, offering core advantages such as high efficiency, reliability, low power consumption, and compliance with safety standards, meeting the market's demands. Moving forward, MEAN WELL will continue investing in high-power-density design and digital power management while integrating renewable energy, energy storage, and DC microgrids. Through one-stop power solutions, MEAN WELL aims to accelerate AI adoption and advance both intelligent and sustainable development.Credit: MEAN WELLCredit: MEAN WELL

Chenbro, a leading server chassis manufacturer, makes a strong presence at the 2025 OCP Global Summit from October 13 to 16 in San Jose, USA. Aligning with this year's theme, "Leading the Future of AI," Chenbro highlights three key business models: OTS (Off-The-Shelf), JDM (Joint Design Manufacturing), and OEM Plus services. Chenbro showcases strong capabilities from product design and mechatronic integration to global manufacturing, helping clients efficiently deploy AI and cloud server solutions and drive innovation in AI data centers.CEO Corona Chen led the Chenbro team to engage deeply with industry leaders. Credit:ChenbroThree Service Models Showcasing Design, Manufacturing, and Customization StrengthsAt this years summit, Chenbro highlights its customer-centric strengths through integrated R&D and manufacturing to accelerate the deployment of next-generation computing platforms and support the rapidly growing AI and cloud markets:OTS, with the slogan "Whatever's Inside, Chenbro Outside" offers flexible and customizable server chassis solutions that enable quick selection and deployment via product roadmap, demonstrating Chenbro’s leadership in product design compatibility and adaptability.JDM, embodying the philosophy "Agile R&D, Infinite Creation" focuses on agile development through global R&D deployment and the Joint Product Design Process (JPDP), while enhancing Design for Manufacturing (DFM) and validation services to deliver reliable, customized solutions.OEM Plus, under the motto "Manufacturing Glocalization" promotes global manufacturing localization through its G-LCIM (Green, Low-Cost, Intelligent Manufacturing) implementation. This strategy enables the establishment of an efficient, flexible production system that ensures high quality and consistent delivery.Chenbro CEO Corona Chen stated that amid the rapidly changing global industrial landscape, the company remains committed to its core strategy "Where our customers are, Chenbro is." Chenbro is actively advancing the localization of its global operations to enhance supply chain flexibility and operational resilience. The company's U.S. NCT facility is scheduled to officially commence operations in the fourth quarter, supporting local customers with front-end design and prototyping services. Meanwhile, its Malaysia mass-production plant is set to begin operations in the first half of next year, alongside ongoing plans for land acquisition and facility construction in Texas for another mass-production site. Looking ahead, Chenbro will continue to integrate automation and AI applications into its manufacturing processes to achieve lean and intelligent production, further strengthening its resilient global operations network.Connecting the OCP Ecosystem with Win-Win Collaboration to Shape the AI FutureAt this year's OCP event, Chenbro presented a comprehensive lineup of innovative products, including modular chassis designed for the OCP DC-MHS architecture, NVIDIA MGX architecture, and-making their debut-customized rack solutions. Together, these exhibits highlight Chenbro's capability to simplify system integration, enhance deployment flexibility, and empower customers to build the next-generation AI infrastructure.OCP DC-MHS Solutions: Chenbro showcased its DC-MHS-compatible designs, underscoring strong support for new-generation CPU platforms and expanding applications for AI inference workloads.GB300 & MGX Platforms: The GB300 system is engineered for large-scale AI model training, while the MGX 4U CX8 targets training and inference for small to medium AI models-demonstrating Chenbro's comprehensive coverage across AI computing demands.Customized Rack Solutions: Beginning this year, Chenbro has expanded into the rack solution business, and at OCP unveiled its first concept rack that supports interchangeable OCP 21-inch and EIA 19-inch standards. Integrated with Chenbro's MGX and DC-MHS chassis, the display reflected the company's growing strength in providing complete mechanical system solutions.In addition, Chenbro featured multiple AI and cloud server systems co-developed with global customers. Through these collaborations, Chenbro has solidified its role as a key enabler in the global transformation toward AI and cloud computing.Chenbro Makes a Major Debut at 2025 OCP Global Summit. Credit:ChenbroThe OCP Global Summit remains a vital platform for innovation and collaboration. CEO Corona Chen led the Chenbro team to engage deeply with industry leaders such as NVIDIA, AMD, Intel, and major CSPs. Chenbro has evolved into a strategic partner with product definition capabilities, directly connecting with global cloud and AI customers while collaborating with ODMs and system integrators to meet market demands. This comprehensive market and design insight accelerates product development and promotes AI application innovation.For more information, please visit.