PEGATRON Corporation ("PEGATRON") returns to COMPUTEX 2026 in Taipei for the second consecutive year. As a Tech Maker, the company integrates R&D, design, and manufacturing to help customers turn emerging technologies into production-ready products.AI is expanding beyond model training into enterprise and industrial applications. This shift shows that customers need not only computing performance, but also system integration, deployment flexibility, and long-term reliability. Through its AI Tech Maker strategy, PEGATRON turns compute, connectivity, sensing, and product design into deployable systems. PEGATRON will highlight three product areas in Computex: AI infrastructure for AI factories and high-performance computing; edge and industrial AI for manufacturing and communications; and physical AI platforms spanning robotics, drones, intelligent vehicles, and smart devices.Building AI Infrastructure for AI Factory and High-Performance ComputingLarge-scale AI deployment is driving new requirements for computing performance, networking bandwidth, thermal management, and system integration.At COMPUTEX 2026, PEGATRON presents a next-generation AI infrastructure portfolio that includes NVIDIA Vera Rubin NVL72, NVIDIA HGX Rubin NVL8, NVIDIA RTX PRO Server, and AMD Instinct MI355X and MI350P GPU server platforms. The solutions support enterprises and cloud service providers building next-generation AI Factory and high-performance computing environments.PEGATRON also showcases 400G, 800G, and 1.6T AI infrastructure switches designed for large-scale AI training and inference workloads requiring high-speed, low-latency data transmission. Open data center solutions compliant with Open Compute Project (OCP) standards are presented to improve scalability, deployment flexibility, and energy efficiency.The portfolio further integrates GPU servers, AI networking, liquid cooling, and full-rack system integration. This approach expands PEGATRON's role from hardware manufacturing toward comprehensive AI infrastructure platform deployment, helping customers shorten implementation cycles for generative AI, agentic AI, and enterprise AI applications.Bringing AI from Digital Twins to Edge ConnectivityAt the industrial AI layer, PEGATRON presents its PEGAVERSE portfolio, a smart manufacturing platform built around digital twins and agentic AI. The portfolio includes ARCHITECT for site planning, YODA for engineering knowledge training, and JEDI for intelligent manufacturing processes. These applications translate PEGATRON's manufacturing experience into repeatable and deliverable industrial AI offerings.In communications and edge AI, PEGATRON showcases next-generation 5G equipment, AI-RAN concepts, Wi-Fi 7 modules, and 6G antennas. The company is also integrating radio units (RUs) with NVIDIA DGX Spark, reflecting the growing convergence of AI compute and communications infrastructure.PEGATRON also presents its Scalable Central Computing Rack (SCCR) for smart mobility. As a vehicle central computing platform, SCCR integrates IVI, gateway, and ADAS functions, addressing the industry shift from distributed vehicle electronics toward centralized architectures and extending edge computing into mobility systems.Expanding Physical AI Across Ground and Aerial PlatformsAI is moving from data centers into physical environments, where autonomous systems must combine sensing, compute, and motion control to operate reliably in complex conditions. At COMPUTEX 2026, PEGATRON presents ground robot and aerial drone platforms that bring physical AI into mobility systems.SIMBA II, PEGATRON's next-generation quadruped robot platform, combines power electronics, mechanical design, sensing systems, and edge AI computing for inspection, monitoring, and automation tasks. Developed with Swiss precision drive specialist maxon, the platform integrates the HEJ 90 high-performance joint system to improve motion control and stability, while supporting real-time environment recognition and autonomous navigation.The G720 SOM+EVK and AI Companion Computer extend PEGATRON's edge computing and visual perception technologies to intelligent drone platforms. Built on MediaTek's MT8391 platform, they support ROS2 and MAVLink integration with flight control systems and mission workflows, enabling navigation, sensing, and real-time image processing. Vision perception and multi-camera imaging modules further support obstacle avoidance and environmental interpretation.Through its ground and aerial platforms, PEGATRON brings AI compute, sensing, and autonomous control into physical mobility systems, turning related technologies into deployable products.Bringing AI and Design into Smart Endpoint DevicesIn smart devices and user experience, PEGATRON applies its DMS model to combine industrial design, engineering, materials, and manufacturing into the product development process. The M16P Optimus modular laptop uses a modular architecture for key components such as the motherboard, I/O, keyboard, battery, and storage. The design allows flexible configuration based on customer requirements and supports easier maintenance, faster customization, and future platform upgrades.The award-winning Armo Emotion Sensing Game Handle brings sensing technology into interactive applications. It integrates heart rate, electrodermal activity, and temperature sensing to analyze physiological signals and adapt gameplay based on user conditions.In personal care, the PRIIo product line extends PEGATRON's design capabilities into everyday consumer applications. The products combine electronic control, sensing technology, and industrial design for facial and scalp care scenarios.PEGATRON said AI development is shifting from technology-led progress toward practical use. The key is turning innovation into products and systems that can operate reliably over time. The company will continue strengthening its productization and integration capabilities while working with global partners to support technology adoption across different environments.PEGATRON's COMPUTEX 2026 booth is located at L0104, 4F, Taipei Nangang Exhibition Center, Hall 1. Professional guided tours will be available during the show.

Edimax Group will host Expo 2026 during Computex 2026, bringing together its group companies, including EDIMAX Technology Co., Ltd. (TWSE: 3047, including its Edimax and Acelink business units), Comtrend Corporation (TWSE: 8089), and SMAX Technology Co., Ltd. The exhibition will take place from June 1 to June 11, 2026, at Edimax Group headquarters in Taipei.Edimax Group to Showcase AI Edge Innovation at Expo 2026. Credit: EdimaxThis year's Expo carries special meaning as Edimax Group marks its 40th anniversary. Since its founding, the Group has grown from a networking equipment developer into a global provider of connectivity technologies across home networking, enterprise and industrial networking, broadband communications, and AIoT applications.For four decades, Edimax Group has focused on one mission: making technology more reliable, practical, and closely connected to real-world business and lifestyle needs. As the company enters this important milestone year, Edimax Group extends its sincere appreciation to its global partners, customers, and supply chain partners for their long-standing trust and support.Expo 2026 Event InformationEdimax is pleased to announce its upcoming exclusive showcase, centered around the theme "AI Edge. Autonomous Future. Resilient Living." Running from June 1 to June 11, 2026, the event will take place at the Edimax Group Headquarters, located at No. 278, Xinhu 1st Road, Neihu District, Taipei, Taiwan.The showcase will be open from Monday to Friday, 9:00 AM to 6:00 PM. Please note that attendance is by appointment only. We cordially invite industry leaders and partners to schedule a visit and explore the next generation of technological innovation with us.Exhibition FocusExpo 2026 will highlight four key areas: Autonomous Future - AI Edge, autonomous operations, and self-service applications for scalable business growth. Ultra-Speed & Trusted Network - Wi-Fi 8, 25G networking, AI management, and green computing for next-generation connectivity. Secure and Resilient Connectivity - Edge networking and AI-driven management to strengthen security and network resilience. Market-Ready Solutions - Proven, ready-to-deploy solutions that help customers accelerate project launches and market adoption.Edimax Group stated that it will continue to deepen the integration of AI, broadband communications, and smart networking technologies while working closely with global partners to advance next-generation intelligent networks and digital applications.Expo 2026 will be held by appointment only. Global partners and customers are invited to visit and experience Edimax Group's latest innovations, celebrate the company's 40-year milestone, and explore the future of smart connectivity.

As AI data center rapidly scales toward the gigawatt (GW) level, energy management is evolving from a supporting function into a defining strategic pillar. Against this backdrop, Infineon Technologies is redefining power infrastructure of AI era through its comprehensive "From Grid to Core" strategy, integrating energy efficiency, power density, and system resilience from the electrical grid to the processor core.Scaling AI: Strategic Power Solutions MatterThe evolution of artificial intelligence (AI) has accelerated far beyond the trajectory once predicted by Moore's Law. As AI models continue to expand in parameter scale and real-time inference becomes increasingly critical, demand for computing power is rising at an unprecedented pace.Today, the power consumption of a single GPU is rapidly approaching the kilowatt level, and the power density of a server rack has increased significantly from less than 60kW in the past to exceeding 100kW, now moving toward a new threshold in the megawatt range.This is not just numerical growth; it represents a fundamental shift in power architecture. As AI computing clusters expand rapidly, traditional 48V busbars and AC power distribution architectures are quickly approaching their physical limits in terms of power loss, thermal management, and spatial constraints.Adam White, President of Infineon's Power & Sensor Systems Division, emphasized that future competition in AI infrastructure will no longer be limited to chip performance. Instead, it will be a cross-disciplinary integration battle encompassing power electronics, materials technology, and system architecture.From Grid to Core: Rethinking the power delivery architectureAt this critical turning point for the industry, Infineon's competitive advantage lies not in a single breakthrough product, but in its ability to orchestrate and optimize the entire power delivery chain at the system level."From Grid to Core" is more than a product strategy - it is a multi-phase architectural framework designed to reshape the future AI energy chain. Developed through early collaboration with global hyperscalers and ecosystem partners, the strategy enables Infineon to address evolving AI power demands across every phase of infrastructure, from utility grids to processor-level power management.Power grid: Enabling a sustainable, high-efficiency power with HVDCAt the front end of the data center, power infrastructure is transitioning from traditional mechanical systems to highly integrated solid-state solutions. Future AI facilities are expected to increasingly adopt decentralized DC microgrids, enabling greater efficiency, flexibility, and resilience in energy management.By leveraging silicon carbide (SiC) technology in solid-state transformers (SSTs), system weight can be dramatically reduced - from nearly 20 tons to approximately 500 kilograms—while simultaneously improving overall energy efficiency by more than 1%. Beyond optimizing space utilization and operational costs, this advancement signals a broader industry migration from electromechanical infrastructure toward semiconductor-driven power systems.As SSTs and related technologies become integrated into AI power infrastructure, a multi-billion-dollar semiconductor opportunity is emerging across next-generation energy systems.At the same time, the power grid is evolving beyond its traditional role as just an energy source. Through digitally controlled power systems with real-time monitoring and remote management capabilities, combined with solid-state circuit breakers (SSCBs) featuring microsecond-level response times, the grid is becoming an intelligent energy platform capable of continuous optimization and predictive management.Server rack: Reshaping power density and maximizing efficiencyAs data centers advance toward GW-scale deployments, power distribution architecture is undergoing a fundamental redesign. Infineon is driving the industry's transition from traditional 48V systems to ±400V and 800V high-voltage DC architectures. Through the design of three-phase power sidecars, Infineon is restructuring power supply and computing systems to establish a more efficient and flexible power distribution model.At the same time, the power architecture of AI data centers is following a clear evolutionary path: moving from integrated server rack designs to high-voltage DC and sidecar power supply configurations, and ultimately advancing to gigawatt-scale infrastructures that incorporate DC microgrids.Meanwhile, The high-frequency characteristics of gallium nitride (GaN) components enable intermediate bus converters (IBCs) to achieve over 98% conversion efficiency and exceptionally high power density in an extremely compact form factor, significantly reducing power transmission losses and freeing up more space for AI computing resources.Processor core: Power density and new architectures for next-gen AI computeAt the processor core—the final stage of power delivery—the challenge shifts toward managing extreme current density and ultra-fast transient response.To support next-generation GPUs requiring massive current delivery and rapid load transitions, Infineon has introduced a digital multiphase PWM controller alongside the industry's first TLVR four-phase power module. These technologies are engineered to provide highly stable, efficient, and responsive power delivery for AI processors operating under increasingly demanding workloads.In response to the next generation of GPUs demanding ultra-high current and rapid load changes, Infineon has introduced digital multiphase PWM controllers and the industry's first TLVR quad-phase module. By leveraging high-precision telemetry and digital control technologies, power systems have transformed from energy suppliers into intelligent platforms capable of real-time monitoring, prediction, and optimization.From AI data center to physical AIIf data centers form the foundation of AI computing power, the physical world will be where AI's true value is ultimately realized. As AI increasingly expands into humanoid robots, autonomous systems, and intelligent manufacturing equipment, demands for energy efficiency, real-time responsiveness, and system reliability will become even more critical.Infineon is extending its long-established expertise in power management beyond data centers into the emerging era of Physical AI. By integrating sensing technologies, actuate, security and connectivity solutions, and high-efficiency power modules, the company is enabling a comprehensive functional blocks that empower humanoid robots to perceive, think, act and connect, safely and secured in a real-world environment.Push the boundaries of power technology in AI era"We Power AI" is not just a slogan for Infineon—it is a concrete commitment to the future of the industry. From gigawatt-scale data centers to physical AI, Infineon continues to push the boundaries of power technology, ensuring that every watt of energy is transformed into the greatest possible value for AI.As the industry advances toward the next generation of computing, energy management will become the decisive key to truly unlocking the full potential of AI. In this wave of transformation, Infineon is joining forces with ecosystem partners to stand at the forefront of defining the future.Editor's Note: Adam White will deliver a keynote address at COMPUTEX 2026 on June 4 titled  "Infineon Powering AI from Grid to Core to Physical AI."  The session will explore emerging trends and strategic opportunities in power infrastructure of AI era.Credit: Infineon