iCatch Technology, a leading provider of AI imaging SoCs and vision processing solutions, today introduced PAISB (Physical AI Sensor Bridge), an HSB-aligned ASIC sensor bridge platform designed to enable scalable multi-sensor data ingest for NVIDIA Holoscan-based Physical AI systems.The first product in the platform family, PAISB-E1, will be demonstrated at GTC 2026 running on NVIDIA Thor at ApproPho Booth #3420.As Physical AI systems increasingly rely on multiple high-bandwidth sensors - including cameras, stereo vision modules, and other perception devices - efficient and deterministic data pipelines from sensors to GPU compute platforms have become critical infrastructure. PAISB addresses this challenge by providing an ASIC-based bridge optimized for time-aligned, low-latency sensor streaming into GPU computing environments.Aligned with the NVIDIA Holoscan Sensor Bridge (HSB) architecture, PAISB enables developers to ingest synchronized sensor streams directly into GPU memory, allowing real-time perception workloads to scale across a wide range of Physical AI applications.At GTC 2026, iCatch will demonstrate PAISB-E1 using FoundationStereo Depth as an application example. The system streams synchronized multi-sensor data to NVIDIA Thor, enabling real-time perception pipelines for robotics and intelligent machines."Physical AI systems demand scalable and deterministic sensor-to-GPU pipelines to process massive volumes of multimodal data in real time," said Weber Hsu, President of iCatch Technology. "With PAISB, we are introducing an ASIC-based sensor bridge platform aligned with the NVIDIA Holoscan ecosystem, enabling developers to build high-performance, time-synchronized sensor architectures for Physical AI platforms."The PAISB platform is designed to support a broad range of Physical AI applications, including robotics, industrial automation, medical imaging, broadcast infrastructure, and automotive perception systems. By enabling high-bandwidth, synchronized sensor ingestion into GPU-based computing environments, PAISB accelerates the deployment of AI systems requiring precise perception and real-time decision-making.To learn more about PAISB and explore collaboration opportunities, visit us at ApproPho Booth #3420 during GTC 2026, or schedule a meeting in advance.

The "Mini SSD Strategic Seminar" convened recently to strengthen collaboration and accelerate ecosystem development following the successful "Mini SSD Ecosystem Application Seminar" held in Shenzhen on January 26.Leading companies across the industry chain, including Intel, BIWIN, Longcheer, BYD Electronics, Luxshare, Emdoor, Weibu, JWIPC, CYX Industrial, MINISFORUM, Decenta, and SIXUNITED, reached a strategic consensus to jointly build the Mini SSD industry ecosystem, marking a significant step toward large-scale adoption of this emerging storage form factor.As the first batch of core builders of the Mini SSD ecosystem, the initial partners will gain early access to patent licensing benefits, as well as the synergies created through ecosystem collaboration. This milestone signals that Mini SSD is evolving from a standalone product innovation into a collaborative, win-win industry ecosystem.Global Recognition: International Awards Validate Mini SSD's Innovation and Commercial PotentialSince its market debut, Mini SSD has rapidly gained recognition on the global stage, earning multiple prestigious international awards that highlight its technological innovation, design excellence, and industry impact.International Awards Validate Mini SSD's Innovation and Commercial Potential. Credit:BIWINTIME Best Inventions of 2025Founded in 1923, TIME Magazine is one of the world's most respected media institutions. Its annual Best Inventions list is widely regarded as a global benchmark for breakthrough innovation. Selected from thousands of nominations worldwide by TIME's editorial experts, the award recognizes inventions that demonstrate outstanding innovation, practical value, influence, and future potential.Edison Awards (Finalist)Named after legendary inventor Thomas Edison, the Edison Awards are often referred to as the "Oscars of Innovation." Judged by more than 3,000 global academics, industry leaders, and technology experts, the awards evaluate candidates across four dimensions: concept, value, impact, and achievement. Mini SSD's recognition as a finalist highlights its world-class standing in technology innovation, market potential, and societal impact.CES TWICE Picks AwardsAt CES 2026, widely known as the world's premier technology showcase, Mini SSD stood out among over 4,000 exhibitors and tens of thousands of products to win the TWICE Picks Awards, presented by leading U.S. consumer electronics publication TWICE. The award honors products demonstrating breakthrough innovation, exceptional quality, and strong market potential, and is widely regarded as a mark of excellence in consumer technology.Embedded World "Best-in-Show"The Best-in-Show Award at Embedded World is one of the most respected honors in the embedded systems industry. Evaluated by professional engineers and industry experts, the award recognizes products that excel in performance, reliability, and real-world application value. The recognition underscores Mini SSD's strong potential across embedded and edge computing environments.MWC "Best in Show"At MWC 2026, Mini SSD also received the "Best in Show Award", jointly selected by leading global technology media including TechRadar, Tom's Guide, Android Central, and T3. The recognition highlights Mini SSD's achievements in technological innovation and user experience, further reinforcing its global industry recognition.Mini SSD Receives Multiple Global Industry Awards. Credit:BIWINToday, Mini SSD has rapidly progressed into commercial deployment, gaining adoption among leading device brands. OneXPlayer, GPD, and Waterworld have already integrated Mini SSD into flagship devices including handheld gaming consoles, AI PCs, and smart albums. Early partners report that the adoption of Mini SSD has enhanced user experience while driving measurable market growth and positive brand perception.From global awards to real-world product adoption, Mini SSD is steadily advancing from technology validation to commercial success.Industry Collaboration: Partners Outline the Future of the Mini SSD EcosystemDuring the seminar, industry participants engaged in in-depth discussions around standardization, ecosystem governance, and application deployment, jointly outlining the strategic roadmap for the Mini SSD ecosystem.Industry Collaboration: Partners Outline the Future of the Mini SSD Ecosystem. Credit:BIWINShared Value and Ecosystem GovernanceParticipants agreed on the need to establish a shared-benefit mechanism to accelerate ecosystem development. Plans include forming a dedicated IP management company and governance framework, with clear policies for incentive structures, licensing models, and revenue distribution, ensuring that ecosystem partners share both the value and growth opportunities generated by the technologyDesign-In and Technical CollaborationLeading partners including Longcheer, Emdoor, MINISFORUM, and GMKtec announced plans to initiate design-in programs for upcoming flagship products such as ultra-thin laptops and Mini PCs. Through joint development, design validation, and system optimization, the industry aims to establish a collaborative innovation model across the entire supply chain.Market Expansion and Application StrategyThe seminar also outlined a value-driven market strategy. For PC platforms, participants discussed the possibility of pre-loading popular games and AI models on Mini SSD, creating new value-added distribution channels that enable hardware vendors to unlock additional revenue opportunities.Moving forward, ecosystem partners will work together to accelerate Mini SSD adoption across handheld gaming devices, AI PCs, robotics platforms, and other emerging edge-AI applications.Enabling Edge AI: Mini SSD Unlocks New Possibilities for Next-Generation DevicesWith its ultra-compact footprint (approximately half the size of a coin), PCIe Gen4 flagship-level performance, LGA packaging for enhanced shock resistance, and SIM-card-style expandability, Mini SSD provides a flexible, high-performance storage solution for next-generation intelligent devices.IMini SSD Unlocks New Possibilities for Next-Generation Devices. Credit:BIWINUltra-Thin LaptopsWeighing just 1 gram and offering 40% smaller volume compared with traditional M.2 2230 SSDs, Mini SSD frees valuable internal space within ultra-thin devices, enabling manufacturers to integrate additional components. Its user-replaceable expansion design also allows users to scale storage capacity as AI PCs increasingly require large datasets for local AI model deployment.Intelligent RoboticsFor robotics operating in high-vibration and complex environments, Mini SSD delivers high-speed read/write performance and strong shock resistance, ensuring stable access to vision and environmental data. Its modular architecture enables flexible storage expansion across the robot’s lifecycle, supporting continuous data accumulation for lifelong learning and system evolution.DronesMini SSD’s shock resistance and wide temperature tolerance ensure reliable performance during high-speed flight, rapid maneuvering, and extreme temperature variations. With capacities up to 2TB, it supports stable recording of 4K and 8K aerial video, providing creators with greater storage capacity for professional content capture.Handheld Gaming DevicesIn high-performance handheld gaming consoles from brands such as GPD and OneXPlayer, Mini SSD delivers console-class loading speeds within a footprint only slightly larger than a TF card. With random read performance up to 850K IOPS, it enables near-instant loading for large 3D games, while meeting the strict space constraints of compact gaming devices.Building the Mini SSD Ecosystem Together for the FutureThe Mini SSD Strategic Seminar marked the formal establishment of the Mini SSD ecosystem on the basis of in-depth technical exchange. With a clear roadmap spanning shared-value mechanisms, unified standards, and Design-in collaboration, industry partners are now aligned around accelerating large-scale adoption.Backed by Shenzhen's market accumulation and fast response of the industry chain, BIWIN will continue working closely with ecosystem partners to develop technical standards, expand application scenarios, and build a thriving Mini SSD industry platform.

EDOM Technology (TWSE: 3048), Asia's best solutions partner, will participate in NVIDIA GTC for the third consecutive year under the theme "From AI to Action: Physical AI in Motion." Together with ecosystem partners, EDOM will showcase its latest AI computing platforms, key components, and system integration capabilities. At Booth #242, EDOM will present physical AI and robotics solutions powered by NVIDIA Jetson hardware and software resources, demonstrating how AI technologies are being developed and deployed across diverse fields such as smart healthcare, vision recognition, and speech understanding. The showcase will highlight EDOM's capability to connect the AI ecosystem and accelerate industry innovation through integrated solutions.During the GTC exhibition, EDOM Technology plans to demonstrate several innovative applications that combine physical AI with edge computing. With the introduction of the NVIDIA Jetson Thor, AI inference and control architectures can now be integrated into a single system, providing a high-performance computing foundation for real-time closed-loop control and multimodal sensing, and accelerating the real-world deployment of multimodal intelligent robots.In the robot interaction showcase, EDOM collaborates with Algoltek to present "Dexterous Hand AI."Powered by 4D AI Vision technology and vision-action models, the system can recognize and predict audience hand gestures in real time and respond accordingly. This demonstration highlights low-latency AI inference and instant feedback, while also presenting a complete Sim-to-Real workflow, from virtual simulation to physical deployment. EDOM also partners with Nexuni to present "AI Workforce: Embodied Intelligence." Built on the NVIDIA Thor platform, the system enables dual-arm robot manipulation through few-shot learning. The demonstration shows a service robot performing household tasks, including object recognition, grasping, and fabric folding. Because fabric is a highly deformable material, handling it requires complex visual perception, state estimation, and coordinated dual-arm control. By leveraging Jetson Thor's edge AI inference and real-time dynamic path correction, the system continuously adjusts its movements during the folding process, improving task success rate and operational stability. This highlights the potential of physical AI in smart manufacturing, human-robot collaboration, and service robotics.In the area of enterprise AI and smart biotech applications, EDOM collaborates with Avalanche Computing to showcase the "Secure Offline Generative AI" platform. Combining enterprise-grade private LLMs with real-time speech intelligence, the platform runs on the NVIDIA Jetson edge platform, enabling low-latency offline speech recognition and semantic analysis. This allows generative AI to deliver real-time interaction within highly secure enterprise environments. EDOM is also working with CyteSi to present the "Software-Defined High-Throughput Wet Lab," an AI-driven laboratory automation platform. CyteSi's EWOD (Electrowetting-on-Dielectric) technology digitally controls micro-droplets with precision, supporting workflows such as NGS sample preparation, drug discovery, and synthetic biology research. The system uses NVIDIA Jetson as its edge computing core, integrating biochips from Japan Display Inc. (JDI) with real-time image analysis capabilities to provide an intuitive user interface and highly efficient experimental workflow, advancing AI adoption in smart biotech research and automated laboratories.In addition, EDOM will showcase the "NVIDIA Jetson Thor Peripheral Ecosystem," integrating a range of EDOM-certified peripheral components, including high-speed storage, Wi-Fi 6/6E and 5G communication modules, GMSL and MIPI cameras, 10G high-speed networking, sensors, camera modules, and high-speed I/O interfaces. This ecosystem helps developers rapidly build next-generation robotics and physical AI systems. Through comprehensive hardware integration and platform support, EDOM assists robotics developers in accelerating product design, deployment, and mass production, further expanding the physical AI and Jetson Thor ecosystem.Jeffrey Yu, CEO of EDOM Technology, stated, "The key to physical AI lies not only in computing performance, but in comprehensive hardware–software integration and ecosystem collaboration. Through NVIDIA's Three-Computer architecture and the Jetson Thor platform, we help customers build scalable, production-ready, end-to-end AI solutions - from model training and simulation validation to edge deployment." He further noted that EDOM is not just a hardware supplier, but is committed to integrating peripheral modules, AI software frameworks, and partner resources to help enterprises accelerate the adoption of AI and robotics technologies.EDOM Technology invites industry professionals, developers, and partners to visit Booth #242. Attendees are also welcome to check out the in-person session featuring Wilson Yen, Product Director at EDOM. The talk explores how EDOM leverages NVIDIA "Three Computers" architecture to help enterprises transform AI models into real-world applications, covering key domains such as computer vision, robotics, and edge AI. Participants are encouraged to add this session to their personal GTC schedule to experience firsthand the innovation of physical AI in action, and to explore the future of intelligent robotics and edge AI. Register now through EDOM's dedicated link to enjoy special GTC Conference registration offers.