As AI-driven high-performance computing (HPC) and chip-to-chip optical interconnects continue to see rapid growth, Hauman Technologies, a leader in test and measurement solutions, has introduced a breakthrough GHz-class, massively parallel bandwidth testing technology in collaboration with AUO Corporation. Designed to address testing efficiency and throughput bottlenecks for next-generation optical communication light sources, the technology made its official debut at SEMICON Taiwan on September 2.Overcoming Mass-Production Bottlenecks with Parallel High-Speed Testing For years, high-frequency characterization of Micro LED chips has relied on time-consuming, die-by-die measurement procedures. While these methods are well suited to detailed device characterization, their limited throughput presents a major challenge for industrial-scale production and broader commercial adoption.Hauman's newly unveiled Micro LED response-time measurement technology addresses this challenge by enabling simultaneous, parallel high-speed testing across multiple dies. With temporal resolution down to 20 picoseconds (ps), the technology captures the transient optical response of individual light sources at different time intervals, enabling key bandwidth-related parameters to be derived without conventional dynamic scanning.By shifting high-speed characterization from sequential measurement toward parallel acquisition, Hauman aims to bring die-level high-speed screening closer to the throughput requirements of semiconductor manufacturing. Advancing Optical Interconnect Testing in Collaboration with AUOThe collaboration combines Hauman's 20-picosecond temporal resolution and high-throughput parallel measurement capabilities with AUO's expertise in optoelectronic integration, Micro LED mass transfer, and low-power optical engines.Together, the companies are working to optimize Known Good Die (KGD) screening for optical communication devices, supporting next-generation AI data centers and "wide-and-slow" optical interconnect architectures."Our latest technology represents a major step forward in high-frequency testing throughput and the viability of production-scale deployment," said Ying-Chu Lin, Vice President of Hauman's Semiconductor Business Division. By enabling parallel measurement across multiple dies while maintaining die-level visibility, we aim to bring high-speed optical characterization closer to the requirements of semiconductor manufacturing.We look forward to working with semiconductor, optoelectronic device, and packaging and testing industry partners to further advance high-throughput optical measurement for next-generation optical interconnects. For more information, please visit Hauman Technologies. Credit: Hauman Technologies

As AI continues to accelerate demand for high-speed optical connectivity, technologies such as silicon photonics, CPO, LPO, NPO and OCS are moving rapidly toward commercial deployment. The next challenge is turning these technologies into scalable, high-yield production.At SEMICON Taiwan 2026, September 2–4 in Taipei, ficonTEC will showcase its intelligent automation solutions at Booth R8124, highlighting how precision automation, assembly and testing can help photonics companies move from advanced technologies to volume production.From assembly and test to intelligent manufacturingAs photonic devices become more complex and volumes increase, manufacturing requires greater precision, repeatability and throughput. ficonTEC's solutions address key stages of the process, including automated assembly, active alignment, fiber preparation and electro-optical testing, with a focus on connecting these capabilities into scalable production environments.The company's presence at SEMICON Taiwan will focus on a key industry question: How can photonics scale at the speed required by AI?The topic will also be explored during the Silicon Photonics Global Summit, held alongside SEMICON Taiwan.ficonTEC's André Lalonde will present "AI Is Scaling Faster Than Test – Rethinking Wafer, Chip and Module Test for the Photonics Era," addressing the evolving requirements for wafer-,chip-and module-level testing.On September 3, Moritz Seyfried will present "Intelligent Manufacturing for AI at Scale," examining how manufacturing intelligence can support the growing production requirements of AI-driven photonics.Together, the exhibition and presentations highlight ficonTEC's focus on connecting assembly, test and manufacturing intelligence to help the photonics industry transition from engineering development to high-volume production.As AI infrastructure continues to scale, the ability to manufacture photonic technologies with the required precision, yield and throughput will become increasingly important.AI is scaling fast. Photonics must scale with it.

Toward Technologies, Inc. concluded its participation in SEMICON Taiwan 2026, held from September 2 to 4 at Taipei Nangang Exhibition Center Hall 1. Under the theme "RELAY, REDEFINED.," the company showcased a broader switching technology portfolio at booth K3168 and demonstrated its transition from a traditional relay supplier to an advanced switching solution partner.Toward presented high-speed and RF switching technologies, Opto-SiC MOSFET relays, reed relays, solid-state relays, high-speed inductors and modularized switching solutions. The exhibition highlighted the company's capabilities from individual components to integrated switching architectures for semiconductor testing, ATE, probe cards, load boards, RF test, AI/HPC, EV/BMS and high-voltage measurement applications.As AI/HPC, high-speed computing, advanced semiconductor testing, EV/BMS and high-voltage electronics continue to develop, switching components must meet increasingly demanding requirements for frequency performance, signal integrity, low leakage, isolation, switching speed, channel density and system integration. Toward's product portfolio is designed to address these needs across high-frequency, high-voltage and power-related test systems.Broadband Conical Inductor Supports High-Frequency Test InterfacesA featured product was Toward's Broadband Conical Inductor, developed for RF and semiconductor test applications. The solution supports frequencies up to 60 GHz and targets RF/microwave, high-speed semiconductor testing and advanced test interfaces. It can be used in bias tees, DC bias injection networks, RF chokes and broadband test interfaces.For probe cards, load boards, RF test fixtures and other high-frequency platforms, introducing DC bias while minimizing its effect on the RF signal path is an important design challenge. By combining the Broadband Conical Inductor with switching technology, Toward is extending its capabilities from a single relay component to RF signal paths, bias networks and system-level switching architectures.Toward also displayed a Broadband Conical Inductor Module based on its AI-0260 series inductor and ALC series modules. The solution illustrates the company's ability to connect high-frequency component technology with high-speed I/O and test platform integration.Opto-SiC MOSFET Relay Targets High-Voltage TestingToward's Opto-SiC MOSFET Relay is designed for EV, BMS, power semiconductor and high-voltage electronic systems. The product integrates a silicon carbide MOSFET with an optically coupled control architecture. It retains key solid-state relay advantages, including no mechanical contacts, long operating life and high-speed switching, while extending load-voltage capability to the kV range.The relay targets high-voltage testing, measurement-path switching and automated test applications. It supports Toward's strategy of developing switching technologies for electrification and power semiconductor test systems, in addition to conventional relay applications.Multi-Technology Platform Supports Customer DevelopmentToward also presented reed relays, RF MEMS, solid-state relays, high-speed inductor solutions and modularized switching solutions. Different technologies offer different advantages, including low contact resistance, high reliability, compact design, low leakage, high-frequency switching performance and high-voltage capability. This multi-technology platform allows customers to select a switching architecture according to their application requirements rather than being limited to one relay type.As semiconductor test and ATE architectures become more complex, customers need more than a relay datasheet. Toward provides capabilities in relay design, RF and high-speed technology, silicon carbide, packaging, manufacturing, testing and module integration. Its support can extend from application requirements and component selection to sample verification, switching module development and production introduction.This component-to-subsystem approach helps Toward address signal routing, RF path design, bias networks, isolation, channel density and mechanical integration. The company aims to help customers develop switching solutions that match the electrical, thermal, mechanical and testing conditions of each target system.International Collaboration and Future GrowthToward Chairman Hsu said the 2026 event was the company's most successful SEMICON Taiwan participation in more than a decade. He noted that many of the products displayed were developed for future applications and that the company's technology investments are intended to support growth over the next 10 to 20 years.Business partners from Italy, Germany, the United Kingdom, Japan and Singapore also visited Toward's booth. Their participation reflected the company's expanding international network. Toward plans to deepen cooperation with customers and technology partners while strengthening its high-speed, RF, high-voltage, power and modularized switching capabilities.Looking ahead, Toward will continue developing solutions for semiconductor test, AI/HPC, EV/BMS, aerospace and defense, industrial automation and medical devices. Through the message "RELAY, REDEFINED.," the company aims to redefine the role of relays in next-generation electronics and semiconductor test systems and to support practical technology deployment with customers and industry partners. For more information, visit Toward Technologies.Toward Technologies executives at SEMICON Taiwan 2026 in Taipei. Credit: Toward Technologies