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REALTIME NEWS
Yuan Jen targets semiconductor shift with focus on packaging, specialty wire materials
Semiconductors
1min ago
Auden expects stronger growth in 2027, sees satellite industry taking another 2–3 years to gain momentum
Communications
1min ago
Each 1% tariff hike could add US$3.5B to US fab costs, SIA warns
Semiconductors
1min ago
United Renewable Energy targets 2x US revenue by 2027 as solar module prices double
Sustainability
3min ago
Nvidia pledges US$250M in AI safety research to UK, CEO defends industry's approach
ICT
14min ago
Korean memory makers accept ASML parts price hike, leaving TSMC as the open question
Semiconductors
17min ago
Samsung, SK Hynix stand to benefit as humanoid robot DRAM demand is forecast to jump 20-fold by 2030
Semiconductors
21min ago
Nvidia's Rubin expected to use mostly 12-layer HBM4 despite reported 8-layer shift
Semiconductors
23min ago
Commentaty: Huawei’s Kirin's road to 2027
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Oct 14, 17:01
Analysis: What's GlobalFoundries calculus behind its US$2 billion entry into TSMC’s CoWoS ecosystem
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Oct 14, 17:01
ProLogium shifts solid-state battery focus to AI and aviation markets
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Oct 14, 17:01
Commentary: What is Musk's plan to catch up with TSMC
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Oct 14, 17:01
Commentary: The many hurdles of Apple HomeView
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Thursday 15 October 2026
Samsung Semiconductor Highlights 400+ Layer Flash Powering Agentic AI
The 5th GMIF Innovation Summit (Global Memory Innovation Forum 2026;GMIF2026), co-hosted by the Shenzhen Memory Industry Association and the School of Integrated Circuits, Peking University, was recently successfully held in Shenzhen...
Hybrid Copper Bonding - A Manufacturing Lever for The AI Era
Wednesday 14 October 2026
Practical Insights & Industry Ideas
Wednesday 14 October 2026
GMIF 2026 Awards: Samsung, SanDisk, BIWIN, and Others Honored
Wednesday 14 October 2026
Chenbro unveils AI rack-level solutions at 2026 OCP Summit
Tuesday 13 October 2026
LATEST STORIES
Thursday 15 October 2026
Samsung Semiconductor Highlights 400+ Layer Flash Powering Agentic AI
The 5th GMIF Innovation Summit (Global Memory Innovation Forum 2026;GMIF2026), co-hosted by the Shenzhen Memory Industry Association and the School of Integrated Circuits, Peking University, was recently successfully held in Shenzhen...
Wednesday 14 October 2026
Practical Insights & Industry Ideas
How can AI become more powerful and, at the same time, more energy-efficient? How is the electronics industry adapting to new cyber resilience requirements? And what is driving the All Electric Society forward? electronica 2026 provides answers to these questions not only in the exhibition area of its 18 exhibition halls, but also through its extensive supporting program...
Wednesday 14 October 2026
Hybrid Copper Bonding - A Manufacturing Lever for The AI Era
The current growth cycle of the semiconductor industry is driven by the demand for logic and memory tied to artificial intelligence (AI), cloud infrastructure, and advanced electronics. This growth is expected to remain robust until 2026 and beyond. The Asia-Pacific region is one of the leading growth regions in this outlook.
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SEMICON Exclusive Interview|Powering the AI Era: The Role of Advanced Materials
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Straight from SEMICON 2026|ZEISS, Henkel, Tescan, and camLine
Straight from SEMICON 2026|PBA Systems, Rigaku, and ABB
COMPUTEX Exclusive|PEGATRON’s NVIDIA Rubin Racks & Physical AI Explained
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K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue
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