DIGITIMES author: Jen-Chieh Chiang

LATEST

Total: 70 items

Japan's LSTC launches optoelectronic advanced packaging project around Rapidus cluster

Thursday 23 April 2026

Research on optoelectronic integration — referring to the application of optical communication technology to computing — is gaining momentum. Its semiconductor packaging component officially got underway in April 2026...

China's export controls spark 140x yttrium price surge, fueling chip equipment fears

Friday 10 April 2026

Yttrium, a critical rare earth element used in semiconductor manufacturing equipment, has seen its global supply tighten sharply due to China's export restrictions, driving prices up about 140x within a year and raising...

Foxconn and Mitsubishi Fuso forge global play in electric buses

Friday 10 April 2026

Foxconn and Mitsubishi Fuso Truck and Bus have forged a strategic partnership aimed at exporting Japanese-made electric buses to Southeast Asia and Australia by 2030, combining Foxconn's rapid EV development...

Asahi Kasei enters AI chip fiberglass market to challenge Nittobo's dominance

Thursday 2 April 2026

Japan's Asahi Kasei has announced its official entry into the AI chip supply chain with fiberglass cloth as an insulating substrate material, targeting the current global leader Nittobo, which holds a 90% market share....

Ajinomoto faces stakeholder pressure to raise ABF prices

Thursday 2 April 2026

UK-based fund Palliser Capital announced on March 31 that it has become one of the top 25 shareholders of Ajinomoto and has requested a price increase of more than 30% for its semiconductor interlayer insulating...

DRAM and NAND costs hit 90% of smartphone prices, squeezing low-end profits

Friday 27 March 2026

Core component costs for smartphones are surging at unprecedented rates, threatening the survival of low-priced models in the market. Nikkei reports that prices for two essential memory types—DRAM (mainly...

Denso proposes acquisition of Rohm to strengthen automotive and power control

Wednesday 25 March 2026

Automotive parts giant Denso, closely linked with Toyota Motor, has officially submitted a proposal to acquire shares in Rohm Semiconductor, signaling its clear intent to pursue a takeover. This move appears to show...

Chinese Premier encourages foreign investment except Japanese firms at China Development Forum

Tuesday 24 March 2026

On March 22, 2026, the Chinese government held the international "China Development Forum" in Beijing, inviting global corporate leaders to participate. Li Qiang, Premier of the State Council, called for foreign...

Honda books US$15.7 billion EV loss after scrapping projects and compensating suppliers

Thursday 19 March 2026

Japan's Honda Motor Co. stunned investors in March 2026 by announcing up to JPY2.5 trillion (approx. US$15.8 billion) in impairment losses tied largely to its troubled push into electric vehicles, underscoring how even...

Samsung reports faster-than-expected 2nm yield gains, aims to triple HBM revenue

Friday 6 March 2026

Samsung Electronics announced that its 2nm process yield is improving faster than expected, signaling strong progress in semiconductor manufacturing. The company also revealed plans for wafer production at its Texas...

SoftBank leads US-Japan alliance investing US$33.3B in Trump gas power plant

Monday 23 February 2026

SoftBank Group (SBG) is spearheading an investment alliance to develop a US-based natural gas-fired power plant project valued at US$33.3 billion, aiming to support infrastructure demands driven by artificial...

Next-gen Ku/Ka metasurface antenna to launch through JDI-Kymeta collab

Sunday 8 February 2026

Japan Display Inc. (JDI) has entered a strategic master supply agreement with Kymeta, a global leader in mobile satellite communications powered by metamaterials technology, to develop glass substrates for a...

Nittobo targets 2028 launch for next-generation glass fiber cloth

Friday 6 February 2026

Nitto Boseki (Nittobo), which currently holds around 90% market share in the semiconductor materials glass fiber cloth segment, is planning to launch its next-generation T-glass glass fiber cloth at early as in 2028,...

TSMC goes all-in on Japan: Kumamoto Fab 2 upgraded to 3nm powerhouse

Thursday 5 February 2026

TSMC has formulated a plan to mass-produce advanced 3nm chips in Kumamoto Prefecture, marking an unprecedented move within Japan. The company has notified the Japanese government of this initiative, with estimated...

Nexperia supply crisis eases as Honda and GAC restart three China plants

Tuesday 27 January 2026

Honda announced on January 26, 2026, that its previously halted Chinese auto factories had gradually resumed production since January 19. The shutdowns were primarily caused by a temporary suspension of shipments from...

TEL expands AI memory capex, targets etching equipment market share

Monday 12 January 2026

Japanese semiconductor equipment maker TEL is ramping up investments to capitalize on a supercycle in memory demand driven by artificial intelligence (AI) servers. With DRAM and other memory prices expected to surge...

Seeking independence from Starlink, Japan backs homegrown satellites

Sunday 11 January 2026

Japan has formally committed to building its own low-Earth-orbit (LEO) satellite constellation, marking a significant shift in how the country approaches communications infrastructure and national security.

TDK targets AI smartphones and foldables, plans to launch next-gen silicon anode battery

Thursday 8 January 2026

Japanese electronic components manufacturer TDK Electronics announced that it plans to update its industry-leading silicon anode battery technology later in 2026, coinciding with Apple and other electronics makers...

Honda delays China factory restart as Nexperia dispute continues to disrupt supply

Tuesday 6 January 2026

Honda Motor said on January 5 that it would delay the reopening of three factories operated by its Chinese joint venture, GAC Honda, after a key automotive chip supplier, Nexperia, halted shipments. The restart,...

Japan's Rapidus to launch advanced packaging pilot line in Hokkaido by spring 2026

Monday 5 January 2026

Japanese chipmaker Rapidus is advancing its 2nm process technology while developing advanced packaging solutions tailored for AI chips. The company aims to officially start trial production on its advanced packaging...

Rohm partners with Nvidia to expand power semiconductor opportunities

Monday 29 December 2025

According to Nikkei, although electric vehicle (EV) demand has been below expectations, weighing heavily on Rohm Semiconductor's SiC power semiconductor equipment investments, the company has decided to expand...

Honda and LG pivot to hybrids as US EV demand weakens

Sunday 28 December 2025

As demand for electric vehicles cools in the United States, Honda Motor of Japan and LG Energy Solution of South Korea are making a significant course correction in their North American electrification plans.

Japanese startup pushes diamond semiconductors toward commercialization in EVs and satellites

Wednesday 24 December 2025

A Japanese startup originating from Waseda University, Power Diamond Systems (PDS), showcased its diamond-based semiconductors at SEMICON Japan 2025, presenting for the first time an evaluation system that confirmed the...

Japan's H3 rocket launch fails, delaying GPS independence

Tuesday 23 December 2025

Japan's flagship heavy-lift rocket, the H3, suffered another setback on Sunday after its eighth flight failed, dealing a blow to the country's ambitions to strengthen its independent space capabilities.

The Nexperia fallout: Honda's factories go quiet in fresh blow to supply chain

Thursday 18 December 2025

Honda Motor Company announced on Wednesday that it would suspend or reduce production at several factories in Japan and China starting late this month, the latest sign that a global scramble for automotive...