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Tuesday 12 May 2026
Research insight: Taiwan's auto tech pushes beyond components into autonomous systems
A DIGITIMES Research observation at the 2026 Taipei International Auto Electronics Show found that Taiwan's automotive electronics industry is steadily shifting from supplying individual components toward integrated systems spanning autonomous driving sensors, in-cabin safety, autonomous logistics vehicles, and localized supply-chain integration
Monday 11 May 2026
DIGITIMES Insight: MediaTek denies Intel link as TSMC's packaging lead faces new test
DIGITIMES senior analyst Luke Lin said Warren Buffett's investment in Apple should be viewed not simply as a stock trade, but as a bet on the company and its leadership under CEO Tim Cook
Thursday 7 May 2026
Research Insight: AI memory boom squeezes automotive supply, driving costs higher
Autonomous driving and smart cockpit technologies are pushing vehicles to demand far more computing power and data processing. Memory has become a critical component in automotive system performance. But as demand surges, AI applications are reshaping the global memory supply chain — reallocating capacity and creating structural pressures that are tightening supply and driving up prices
Monday 4 May 2026
Research Insight: Beijing auto show signals shift from vehicle launches to AI-driven supply chains
The 2026 Beijing Auto Show has emerged as a platform where the balance of competition is shifting from sheer vehicle counts to advanced self-driving systems, AI-powered cockpits, and integrated supply chain collaborations, DIGITIMES Research observed. The event showcased both domestic and foreign manufacturers alongside key automotive intelligence suppliers
Monday 27 April 2026
DIGITIMES Insight: Will TSMC's 3nm expansion put Samsung's 2nm bid on the back foot?
As the AI buildout accelerates and chipmakers race to secure advanced process capacity, TSMC finds itself in an increasingly commanding position
Friday 24 April 2026
DIGITIMES Insight: SK Hynix's US HBM push sets up a showdown with Micron
SK Hynix Inc. has moved to deepen its presence in the US by building an HBM packaging and testing plant and planning a US stock exchange listing to raise capital — steps that could bolster local high-bandwidth memory supply and reshape competition with Micron Technology Inc
Monday 23 March 2026
Research insight: F1's 2026 regulations reshape powertrain competition and accelerate low-carbon transition
With the 2026 Formula One (F1) season opener in Australia, the first competitive validation of the sport's new regulatory framework has already highlighted the impact of a fundamental powertrain shift. Mercedes-AMG secured a dominant one-two finish, underpinned by a clear performance gap. In qualifying, the team achieved a pole position lap time approximately 0.8 seconds ahead of the third-place competitor, while extending a lead of more than 15 seconds over Ferrari during the race
Friday 20 March 2026
Research Insight: AI reshapes Taiwan's PCB industry around high-end capacity and materials
DIGITIMES observes that as demand surges for AI servers, high-speed switches, optical communication modules, and edge AI devices, Taiwan's PCB industry is undergoing a structural shift in its growth model. The traditional cyclical, recovery-driven growth is giving way to competition centered on high-end capacity deployment, control of critical materials, and global expansion capabilities
Monday 9 March 2026
Research Insight: Global EV charging stations to surpass 9 million by 2026 as China, Europe expand
Global public electric vehicle (EV) charging infrastructure is projected to reach 9.01 million stations worldwide by 2026, according to DIGITIMES Research. The market is expected to show increasing regional divergence as China and Europe maintain steady expansion, while momentum in the US softens
Monday 2 March 2026
Insight: Broadcom delivers 2nm 3.5D AI processor, expanding custom chip push against Nvidia
Broadcom has begun shipping the industry's first 2nm custom compute SoC built on its 3.5D eXtreme Dimension System in Package (XDSiP) platform to Japan's Fujitsu, marking a concrete step from roadmap promise to commercial deployment in the AI infrastructure race
Monday 2 March 2026
Insight: Memory shortage tightens grip on smartphone market as prices near tipping point
The memory market is no longer just a component story — it is becoming a fault line running through the entire tech industry. As AI infrastructure buildout accelerates, cloud and data-center operators are consuming DRAM and NAND at a pace that is crowding out smartphone makers, distorting foundry economics, and forcing chipmakers to rethink how they secure supply. The consequences are rippling from factory floors in Asia to boardrooms in Silicon Valley
Thursday 26 February 2026
Insight: Qualcomm ships rack-scale AI systems built on 2019 AI 100 chip; analyst sees structural barriers
Qualcomm has begun delivering rack-scale AI hardware and software systems for data centers, built around its AI 100 inference chip. The move signals a renewed push into a market where Nvidia and AMD currently set the standard
Thursday 19 February 2026
DIGITIMES Insight: TSMC's swelling facilities budget signals a global capacity race
When chipmakers spend big, it is usually the machines that cost the most. Process equipment — the lithography tools, deposition systems, and etch chambers that define the bleeding edge of semiconductor manufacturing — has historically commanded the largest share of TSMC's capital budget. Facilities and civil construction matter, but they have rarely led the bill. That conventional wisdom is now being tested
Thursday 19 February 2026
DIGITIMES Insight: US tariff-credit design could pressure Korean memory makers to localize production
A proposed US tariff and duty-exemption framework could force Korean memory suppliers to accelerate US fab investments or risk losing AI server market share, according to DIGITIMES analyst Luke Lin, speaking on a DIGITIMES podcast
Wednesday 18 February 2026
DIGITIMES Insight: TSMC's Kumamoto 3nm upgrade targets automotive, AI demand rather than Rapidus
TSMC's decision to upgrade its second Kumamoto fab to 3nm reflects long-term customer demand and supply chain strategy rather than competitive pressure from Rapidus, according to Luke Lin, speaking on a DIGITIMES podcast