TSMC, GF expand US capacity with first silicon interposer line
2min ago in Semiconductors
Former Intel CEO Pat Gelsinger sees hardware renaissance in memory, optical interconnects
2min ago in Semiconductors
Shield AI delivers first V-BAT drone to Taiwan Coast Guard
2min ago in Aerospace
Starlink moves from satellite overlay to mobile challenger as SpaceX builds hybrid network
3min ago in Aerospace
AI memory boom pushes smartphone market into premium-first reset
4min ago in Communications
PMIC vendors diverge as PC exposure drives revenue gap
8min ago in Semiconductors
Huawei accelerates ASEAN data center hardware supply as Kunpeng chip exports surge
8min ago in ICT
Smartphone costs surge as brands take divergent action
11min ago in Communications
Taiwan FPCB maker CMI targets flat 2026 revenue despite memory, CPU shortages hitting notebook demand
11min ago in Semiconductors
Linde LienHwa links HaaS ecosystem to drive industrial decarbonization
11min ago in Sustainability
Y.S. Tech reports liquid-cooling orders secured through early 2028
12min ago in Electric Vehicles
India's Tessolve raises US$75 million from Vector Line Capital to fund chip-services acquisitions
12min ago in Semiconductors
Amazon's Decart talks point to a broader push from custom silicon to world models
25min ago in ICT
China's wafer-scale graphene breakthrough brings quantum rectifiers closer to semiconductor integration
26min ago in Semiconductors
Shanghai HiSilicon expands DDI push across all display sizes
Oct 13, 18:14 in Tomorrow's Headlines
Applied Materials CEO outlines a trio of innovation priorities for AI chip race
Oct 13, 18:13 in Tomorrow's Headlines
China’s domestic AI chips target 3D packaging, optical interconnects and software ecosystems
Oct 13, 18:13 in Tomorrow's Headlines
AI accelerator growth shifts toward value, not volume
Oct 13, 18:13 in Tomorrow's Headlines
Analysis: China’s EV exports shift from volume to value as rebates shrink
Oct 13, 18:13 in Tomorrow's Headlines