Global technology and innovation leader ASMPT will showcase its advanced packaging portfolio at SEMICON Taiwan 2026, taking place from September 2 to 4 in Taipei. At Booth L0716 (TaiNEX 1, Level 4). ASMPT will be presenting technologies supporting next-generation AI, High-Performance Computing (HPC), Co-Packaged Optics (CPO) and photonics applications under the theme "Empower the Intelligence Revolution." Reflecting its continued commitment to Taiwan, one of the world's leading semiconductor hubs, ASMPT is also strengthening its local leadership and customer engagement capabilities.
Taiwan remains a key center for semiconductor innovation and advanced packaging. Working closely with customers across the region, ASMPT supports the industrialization of next-generation semiconductor technologies, helping bring advanced concepts into reliable, high-volume manufacturing and enabling the innovations that power the AI era.
As part of its continued investment in Taiwan, ASMPT appointed Johnny Fan as General Manager, Country Head & Head of Sales, Semiconductor Solutions Taiwan, further strengthening its local leadership and customer support.
"Taiwan is at the forefront of semiconductor innovation, particularly in advanced packaging technologies that are enabling the AI era," said Johnny Fan. "Our customers are driving some of the world's most advanced semiconductor innovations in AI, HPC and photonics. The challenge is turning those innovations into production-ready solutions at scale, and that's where ASMPT helps its customers succeed."
As AI applications continue to drive demand for more powerful and efficient semiconductor architectures, advanced packaging is playing an increasingly important role in delivering the required performance, power efficiency and integration. At SEMICON Taiwan 2026, ASMPT will present solutions supporting applications in HPC, AI accelerators, silicon photonics and Co-Packaged Optics (CPO), leveraging technologies such as Thermocompression Bonding (TCB) and Hybrid Bonding.
As an example of these capabilities, ASMPT will showcase its MEGA multi-chip bonding solution. MEGA combines high-precision placement with alignment accuracy of ±2μm and ±0.1°, integrated epoxy dispensing and stamping capabilities, parallel processing of multiple adhesive materials, immediate UV fixation and integrated 3D inspection of the adhesive application. Independently operating pick and bond arms, together with a flip-pick unit and integrated rotation stage, enable flexible process execution for complex multi-chip and photonics applications
Johnny Fan, ASMPT Taiwan Country Head, drives customer engagement & local ecosystem. Credit:ASMPT
