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Samsung to break ground on KRW6 trillion Onyang HBM packaging plant in September

, DIGITIMES, Taipei
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Credit: Samsung

Samsung Electronics will break ground in September on a KRW6 trillion (approx. US$4.31 billion) HBM production and advanced-packaging facility at its Onyang campus in Asan, South Korea, after the project cleared a provincial urban-planning review...

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