CONNECT WITH US

Intel CEO doubles down on advanced packaging with former SK Hynix chief's return

, Taipei
0

Credit: SK Hynix

Former SK Hynix CEO Lee Seok-Hee is set to return to Intel as executive vice president (EVP) of Intel's foundry business, strengthening Intel's push into advanced packaging technologies. The appointment also represents another strategic move by Intel CEO...

The article requires paid subscription. Subscribe Now