PCIM 2026: Overcoming thermal warping in direct-cooled EV power modules

, DIGITIMES Asia, Nuremberg

Jun 12, 2026, 11:03 0

Credit: DIGITIMES

As wide-bandgap (WBG) semiconductors like silicon carbide (SiC) and gallium nitride (GaN) take the lead in electric vehicle (EV) powertrains, electronics packaging engineers are facing a thermodynamic reckoning. To extract maximum performance from these...

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