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TSMC CoPoS equipment orders face reshuffle with legal turmoil at Taiwanese equipment maker

Monica Chen, Taipei

Apr 24, 2026, 15:46 0

Credit: DIGITIMES

The semiconductor packaging equipment sector is experiencing order shifts linked to significant executive changes at a key Taiwanese supplier, raising concerns over TSMC's chip-on-wafer-on-substrate (CoWoS) and chip-on-panel-on-substrate (CoPoS) advanced...

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