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TPK and ASE to launch advanced semiconductor TGV packaging with 3Q26 pilot line

Siu Han, Taipei Apr 13, 2026, 10:00 0

Credit: DIGITIMES

Touch panel maker TPK is partnering with semiconductor packaging giant ASE to enter the advanced through-glass via (TGV) packaging technology sector, focusing on developing glass substrates for high-end computing ICs. This move marks TPK's expansion...

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