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Skytech delivers self-made PLP equipment, eyes record 2026 growth

Monica Chen, Hsinchu; Eifeh Strom, DIGITIMES Asia 0

Credit: DIGITIMES

As advanced packaging technologies continue to evolve toward larger sizes and panel formats, Skytech CEO George Yi stated that in response to the key process requirements of next-generation chip-on-panel-on-substrate (CoPoS) advanced packaging, the...

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