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UMC accelerates advanced packaging and silicon photonics development as AI drives demand

Monica Chen, Hsinchu; Jingyue Hsiao, DIGITIMES Asia Thursday 29 January 2026 0

Credit: DIGITIMES

As artificial intelligence (AI) applications expand globally, United Microelectronics Corporation (UMC) is intensifying its efforts in advanced packaging and silicon photonics (SiPh) technologies. UMC co-president Jason Wang highlighted that although...

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