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Japan's Rapidus to launch advanced packaging pilot line in Hokkaido by spring 2026

Jen-Chieh Chiang, Taipei; Charlene Chen, DIGITIMES Asia Monday 5 January 2026 0

Credit: DIGITIMES

Japanese chipmaker Rapidus is advancing its 2nm process technology while developing advanced packaging solutions tailored for AI chips. The company aims to officially start trial production on its advanced packaging line in April 2026.

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