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SK Hynix taps ASMPT for HBM4 TC bonders amid Hanmi-Hanwha patent clash

Levi Li, DIGITIMES Asia, Taipei 0

Credit: AFP

SK Hynix has reportedly placed a new order for thermal compression (TC) bonders with Singapore-based ASMPT as it accelerates preparations for HBM4, underscoring both the strategic importance of advanced packaging...

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