AI chip packaging complexity drives surge in equipment orders

Monica Chen, Hsinchu; Charlene Chen, DIGITIMES Asia Monday 3 November 2025 0

Credit: DIGITIMES

TSMC is accelerating development beyond the 2nm process node while expanding mass production of CoWoS-L, SoIC, and next-gen WMCM and CoPoS technologies. The semiconductor industry is entering a "complexity explosion" phase in advanced packaging, boosting...

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