STATS ChipPAC targets 600mm panel-level packaging in roadmap for next-generation AI chips

Henry Hsu, Singapore; Joseph Chen, DIGITIMES Asia Thursday 30 October 2025 0

Credit: DIGITIMES

Dr. Nokibul Islam, Senior Director at STATS ChipPAC, presented the company's advanced packaging technology roadmap at the 2025 Advanced Packaging Developers Conference (APDC), identifying advanced packaging...

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