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Singapore leverages advanced packaging to capture share of US$1 trillion chip market

Henry Hsu, Singapore; Joseph Chen, DIGITIMES Asia Thursday 30 October 2025 0

Credit: Henry Hsu

Terence Gan, Executive Director of Singapore's A*STAR Institute of Microelectronics (A*STAR IME), delivered a confident address at the 2025 Advanced Packaging Developers Conference (APDC), unveiling Singapore's ambition to become a global center for...

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