CONNECT WITH US

Intel's 18A and advanced packaging boost Taiwanese IP design firms

Monica Chen, Taipei; Charlene Chen, DIGITIMES Asia 0

Credit: DIGITIMES

Intel, a leader in semiconductor integrated device manufacturing (IDM), is advancing its cutting-edge processes, such as 18A and 2.5D/3D advanced packaging. Taiwanese design service providers like Faraday have confirmed securing multiple new projects,...

The article requires paid subscription. Subscribe Now