Below are the most-read DIGITIMES Asia stories from the week of September 8–September 14.
Synopsys' IP business underperforms in 3QFY25, announces 10% workforce reduction
As of July 31, 2025, US electronic design automation (EDA) giant Synopsys reported third-quarter revenue and profit for fiscal year 2025 that fell below market expectations. The shortfall was attributed to ongoing challenges stemming from US export restrictions on China and strained relationships with key foundry partners. In response, the company announced a 10% reduction in its workforce.
Exclusive: Broadcom secures US$10B ASIC win, Apple and xAI next in line
Broadcom issued robust earnings guidance alongside its latest financial results, with CEO Hock Tan disclosing a significant US$10 billion ASIC mass-production order from a major new customer outside the company's traditional hyperscale cloud service provider base.
Exclusive: TSMC turns legacy fabs into EUV pellicle powerhouse, signals new front in chipmaking
TSMC has announced plans to exit its gallium nitride (GaN) foundry business within the next two years, with production set to cease at its 6-inch Fab 2 located in Hsinchu Science Park. In addition, the company is preparing to consolidate its three 8-inch facilities — Fab 3, Fab 5, and Fab 8 — and is expected to redeploy up to 30% of the workforce to its sites in the Southern Taiwan Science Park (STSP) and Kaohsiung. The move aims to address labor shortages, reduce operational costs, and enhance asset utilization.
HBM race intensifies: Micron's yield confidence fuels supply chain bets
The high-bandwidth memory (HBM) market has emerged as one of the most fiercely competitive segments in the semiconductor industry, with Micron Technology demonstrating strong confidence in its position. The company announced that its entire 2026 HBM production has been fully booked, underscoring surging demand and reinforcing Micron's competitive position in this rapidly growing market.
TSMC and ASE form 3D IC alliance with 34 members to overcome advanced packaging bottlenecks
To overcome the technical hurdles, mass production complexities, and yield issues associated with advanced packaging technologies like 3D IC and CoWoS, SEMI has partnered with TSMC and ASE Holdings to launch the "3DIC Advanced Manufacturing Alliance." This initiative brings together key players from the equipment and materials sectors to develop a robust, globally competitive local supply chain. The goal is to ensure backend manufacturing no longer serves as a bottleneck to growth in the rapidly expanding artificial intelligence (AI) industry.
Samsung weighs new ASML High NA EUV purchases to narrow gap with TSMC in 2nm race
The race for advanced process leadership among TSMC, Samsung Electronics, and Intel is heating up, with the speed of new equipment procurement emerging as a critical point of industry attention.
Beijing Tsinghua professor warns China must cut AI reliance on Nvidia
At a forum held in Singapore, Wei Shaojun—vice chairman of the China Semiconductor Industry Association and professor at Tsinghua University—called on Asian nations, particularly China, to lessen their reliance on Nvidia GPUs for AI model training and deployment. He emphasized the importance of accelerating the development of indigenous AI chips to enhance regional self-reliance in critical technologies.
Article edited by Jerry Chen
