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SEMICON Taiwan 2025: Hanmi Semiconductor unveils large 2.5D packaging equipment

Jessica Tsai, Taipei; Jingyue Hsiao, DIGITIMES Asia Friday 12 September 2025 0

Credit: DIGITIMES

The rising demand for AI servers and high-end GPUs has fueled growth in large-size 2.5D interposers, and Hanmi Semiconductor is moving quickly to capture this opportunity. At SEMICON Taiwan 2025, the South Korean company debuted its "2.5D big-die TC/FC...

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