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PTI aims to be first FOPLP supplier in AI server supply chain

Siu Han, Taipei; Charlene Chen, DIGITIMES Asia 0

Credit: DIGITIMES

Fan-out panel-level packaging (FOPLP) is poised to become the next-generation advanced packaging technology, driving industry competition and research investment. Leading outsourced semiconductor assembly and test services (OSATs) such as ASE Holdings...

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