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Nvidia to adopt CoWoP advanced packaging for 2027 AI GPU, reshaping PCB supply chain

Flora Wang

Flora Wang

, Taipei

Aug 22, 2025, 09:34 0

Credit: DIGITIMES

Nvidia Corporation is set to implement a new advanced packaging technology called Chip-on-Wafer-on-Platform PCB (CoWoP) for its next-generation GR150 AI GPU, expected to launch in 2027...

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