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UCIe 3.0 doubles bandwidth, expands chiplet ecosystem — Intel's Das Sharma on AI and compatibility

Sherri Wang, DIGITIMES Asia, Taipei Monday 11 August 2025 0

Debendra Das Sharma, Intel Senior Fellow and the chair of the UCIe Consortium. Credit: Sherri Wang

The Universal Chiplet Interconnect Express (UCIe) standard has taken a decisive step forward with the release of version 3.0, delivering up to 64 GT/s throughput and doubling bandwidth density to meet the surging demands of AI, high-performance computing,...

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