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TSMC, Intel, MediaTek push open chiplet vision at OCP Taipei

Joseph Chen, DIGITIMES Asia, Taipei 0

Debendra Das Sharma, Intel Senior Fellow and the chair of the UCIe Consortium. Credit: Joseph Chen

Leading semiconductor companies voiced strong support for open chiplet standards at the OCP APAC Summit 2025 in Taipei, signaling growing industry alignment around Universal Chiplet Interconnect Express (UCIe) as a foundational technology for next-generation...

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