OCP APAC 2025: ASE doubles down on co-packaged optics as AI reshapes semiconductor design

Joseph Chen, DIGITIMES Asia, Taipei Wednesday 6 August 2025 0

Credit: Joseph Chen

As artificial intelligence continues to redefine the architecture and demands of modern computing, ASE is positioning Co-Packaged Optics (CPO) and advanced packaging at the center of next-generation data infrastructure.

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