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HBM divide deepens: SK Hynix diversifies, Samsung pulls in-house

Amy Fan, Taipei; Levi Li, DIGITIMES Asia Friday 20 June 2025 0

Credit: Samsung

SK Hynix is doubling down on diversifying its supply chain for thermal compression bonding (TCB) equipment, crucial for producing high-bandwidth memory (HBM), while Samsung Electronics appears to be moving in the opposite direction, prioritizing internalization...

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