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SpaceX eyes FOPLP as Washington pushes chip packaging reshoring

Monica Chen, Hsinchu; Charlene Chen, DIGITIMES Asia Thursday 5 June 2025 0

Credit: AFP

Market sources report that SpaceX, the low-earth orbit satellite giant founded by Tesla CEO Elon Musk, is accelerating its expansion into fan-out panel-level packaging (FOPLP). The company aims to establish a new advanced packaging factory "built in...

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