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Samsung races to deliver HBM3E memory to Nvidia but faces certification hurdles

Jessica Tsai, Taipei; Elaine Chen, DIGITIMES Asia 0

Credit: AFP

In the high-stakes race to supply memory for the next generation of artificial intelligence, Samsung Electronics is under mounting pressure to deliver its 12-layer HBM3E chips to Nvidia by the end of 2025. But as its self-imposed deadline approaches,...

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