DEEPX, an innovator at the forefront of ultra-efficient on-device AI semiconductor technology, has announced a strategic partnership with AIC Inc., a global leader specializing in enterprise storage and server solutions. The partnership, formalized through a Memorandum of Understanding (MoU) at Computex Taipei 2025, is set to redefine AI capabilities in edge computing markets.
The official signing ceremony on May 21 at AIC's booth unveiled ambitious plans to integrate DEEPX's advanced Neural Processing Units (NPUs) with AIC's robust industrial-grade server platforms. This collaboration aims to deliver unprecedented computational power combined with significant energy efficiency and compact form factors tailored specifically for edge environments. Notably, the jointly developed servers—such as the AIC CB201-CP model equipped with eight DEEPX DX-H1 AI accelerators—have already met the stringent specifications required by major enterprise customers in the technology sector. This particular solution is currently undergoing verification as an on-premise AI server in collaboration with a leading South Korean IT conglomerate, demonstrating readiness for deployment in demanding commercial environments.
Through close collaboration, DEEPX and AIC will develop innovative AI-optimized hardware solutions, including reference architectures and demonstrative systems. These offerings will cater directly to global system integrators and OEM partners demanding reliable, scalable, and economically viable AI solutions at the edge. Target applications include smart retail analytics, industrial automation processes, intelligent surveillance systems, and edge data center operations. Additionally, this partnership enables DEEPX to enter new markets such as Media & Entertainment, broadening its reach and creating new growth opportunities.
This partnership aligns strategically with DEEPX's ongoing global expansion and ecosystem-building efforts. By leveraging AIC's deep-rooted expertise in system integration and its extensive global manufacturing capabilities, DEEPX is positioned to further democratize access to high-performance AI solutions, ensuring their applicability and practicality across diverse real-world scenarios.
Immediate plans involve rapid validation of integrated systems and accelerated joint engagements with key international customers. The combined strengths of DEEPX's semiconductor innovation and AIC's server expertise promise transformative AI solutions that respond directly to the surging demand for secure, scalable, and power-conscious AI deployments in surveillance, industrial, and edge computing environments. To stay updated on the latest from DEEPX, follow the official DEEPX LinkedIn page.
About DEEPX
Founded in anticipation of an era when artificial intelligence will be as pervasive as electricity and Wi-Fi, DEEPX develops core technology for high-performance AI semiconductors and computing solutions that bring intelligence to electronic devices. DEEPX currently holds over 326 patents pending in the U.S., China, and Korea—one of the largest patent portfolios in the world for on-device AI chip development.
DEEPX's AI semiconductors are optimized for various applications, improving energy efficiency while enabling advanced AI functionality. The company is collaborating with customers such as Hyundai Kia Motors Robotics Lab, POSCO DX, Jahwa Electronics, LGU+, and Inventec on mass-production developments. In addition, DEEPX works with more than 120 global organizations in areas like smart cameras, surveillance systems (AI NVR), smart factories, robotic platforms, and AI servers, and conducts strategic global promotions in the United States, China, Taiwan, and Europe.
About AIC
AIC Inc. is a global leader in the design and manufacturing of high-performance server and storage solutions. With nearly 30 years of expertise, AIC is renowned for its high-density storage servers, storage server barebones, and AI storage solutions. The company operates globally, with offices in the United States, Asia, and Europe, and is committed to driving innovation across various industries.
Article edited by Jack Wu
