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Home Tech Semiconductors

AI GPU orders max out TSMC’s CoWoS capacity; IC testing firms booked through 2026

Flora Wang

Flora Wang

, Taipei

Feb 25, 2025, 11:23 0

Credit: DIGITIMES

More than 70% of TSMC’s CoWoS-L advanced packaging capacity has already been booked, fueled by strong demand for Nvidia’s Blackwell GPUs...

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