Samsung Foundry aims to launch AI-integrated solution with 1.4 nm process, BSPDN, and SiPh technologies by 2027

Daniel Chiang; Judy Lin, DIGITIMES Asia 0

Credit: Samsung

Samsung Electronics is introducing the 1.4 nm process, BackSide Power Delivery Network (BSPDN), and Silicon Photonics (SiPh) technologies by 2027 to enhance its AI solution strategy integrating wafer foundry, memory, and advanced packaging.

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