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AUO unit plans to ride synergy gains momentum into entering TSMC ecosystem

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AI buildout lifts demand for China high-speed optical module makers

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SJSemi expands 2.5D packaging to 3.3-reticle size for AI and HPC chips

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Taiwan IPC makers pursue international markets

Ninelu Tu

Ninelu Tu

, Taipei

Jan 17, 2024, 09:47 0

Credit: ISE

The growing trend of smart manufacturing has increased demand for computing power across all industries...

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