GenAI drives HBM packaging innovation: SK Hynix and Micron forge ahead, Samsung seeks new path

Jessica Tsai; Willis Ke, DIGITIMES Asia 0

Credit: AFP

In the race for dominance in high-bandwidth memory (HBM), SK Hynix and Micron have already established the direction for the next generation of HBM packaging technology. However, Samsung Electronics lags behind, lacking a clear packaging technology...

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