Samsung set to roll out HBM4 in 2025 incorporating advanced packaging solution

Daniel Chiang; Willis Ke, DIGITIMES Asia 0

Credit: SK Hynix

Samsung Electronics has unveiled a strategic memory roadmap, aiming to release a new generation of high-bandwidth memory (HBM) product, HBM4, by the year 2025. In this ambitious endeavor, the company intends to incorporate both 2.5D and 3D packaging...

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