CONNECT WITH US

Advanced packaging capacity to surge 30–40% in 2024, says TrendForce

Jessie Shen, DIGITIMES Asia, Taipei 0

Credit: DIGITIMES

With major CSPs aggressively building AI servers and pushing up demand for AI processors and HBM memory, global advanced packaging capacity is predicted to expand by 30–40% in 2024, according to TrendForce.

The premium content you are trying to open requires News database subscription. Please sign in if you wish to continue.