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Intel to establish advanced packaging fab in Malaysia

Monica Chen, Penang; Rodney Chan, DIGITIMES Asia Wednesday 23 August 2023 0

Credit: DIGITIMES

Intel has invested a total of US$8 billion in Malaysia, and is committing an additional US$6 billion for the construction of new semiconductor facilities there, including a 3D advanced packaging plant, according to Steve Long, Intel GM of Asia Pacific...

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