Japanese precision component manufacturer Orbray announced that it has signed a contract with automotive semiconductor R&D corporation Mirise Technologies to conduct R&D on diamond power semiconductors. In addition, Orbay also stated that it is investing JPY10 billion (US$72 million) to build a diamond substrate factory for automotive semiconductors.
Reports from Nikkan and Yomiuri Shimbun stated that Mirise Technologies, a joint venture semiconductor R&D corporation between Toyota and Denso, and Orbay announced in May 2023 that they have signed a three-year joint R&D contract. They will combine the two companies' diamond substrate and power component technologies and apply them to the development of vertical diamond power devices to meet the EV demand.
Among them, Orbray will be responsible for developing the p-type conductive diamond substrate while Mirise Technologies will develop the continuous withstand voltage structure within the power components.
After the three-year R&D partnership, the two sides will negotiate further R&D agreements. It is estimated that diamond semiconductors can be put into practical applications in 10 years.
Orbray will also invest US$72 million to obtain a 55,000 square meter land in Yuzawa, Akita prefecture, and build a new factory for diamond substrates and EV components like ECUs. It's estimated that the factory will begin construction in the second half of 2025. By 2032, the production capacity of optical communication and precision gemstone components in its existing factories will be transferred and concentrated at the new factory.
Orbray is originally a manufacturer of precision gemstone components, small motors, and medical machines. It has begun investing in the diamond substrate business in recent years. According to Orbray, compared to silicon, silicon carbide (SiC), and gallium nitride (GaN), diamond is a better material for next-generation automotive semiconductors because it can withstand high voltages and dissipate heat better.
In April 2022, Orbray announced that through an R&D collaboration with Saga University, it can already mass-produce a 2-inch ultra-high-purity diamond substrate. The possibility of realizing diamond power semiconductors has been improved.
In April 2023, a Saga University research team led by Prof. Kasu Makoto announced that it has developed the world's first diamond semiconductor power conversion circuit. The switch of voltage and current can be conducted at a speed of 10 nanoseconds and used continuously for 190 hours without degradation.
Article translated by Jack Wu
