Semiconductor manufacturers worldwide are forecast to increase 300mm fab capacity to an all-time high of 9.6 million wafers per month in 2026, according to SEMI.
"While the pace of the global 300mm fab capacity expansion is moderating, the industry remains squarely focused on growing capacity to meet robust secular demand for semiconductors," said Ajit Manocha, SEMI President and CEO. "The foundry, memory, and power sectors will be major drivers of the new record capacity increase expected in 2026."
Chipmakers expected to increase 300mm fab capacity during the 2022 to 2026 forecast period to meet growth in demand include GlobalFoundries, Hua Hong Semiconductor, Infineon, Intel, Kioxia, Micron, Samsung, SK Hynix, SMIC, STMicroelectronics, Texas Instruments, TSMC, and UMC, SEMI said. The companies are planning 82 new facilities and lines to start operations from 2023 to 2026.
Due to US export controls, China will continue to focus government investments on mature technology to lead in 300mm front-end fab capacity, increasing its global share from 22% in 2022 to 25% in 2026, reaching 2.4 million wafers per month, SEMI said.
Korea's worldwide 300mm fab capacity share is expected to slip from 25% to 23% from 2022 to 2026 on weak demand in the memory market, SEMI indicated. Taiwan is on track to retain third place despite a slight dip in share from 22% to 21% during the same period, while Japan's share of worldwide 300mm fab capacity is also expected to edge down, from 13% last year to 12% in 2026.
Powered by strong demand in the automotive segment and government investment, the Americas and Europe & Mideast are expected to see 300mm fab capacity share growth from 2022 to 2026, SEMI noted. The Americas' global share is forecast to rise 0.2% to nearly 9% by 2026, while Europe & Mideast is projected to increase its capacity share from 6% to 7% and Southeast Asia is expected to maintain its 4% share of 300mm front-end fab capacity during the same period.
The SEMI report also shows analog and power leading other sectors in capacity growth at a 30% CAGR from 2022 to 2026, followed by foundry at 12%, opto at 6% and memory at 4%. Published on March 14, 2023, the report lists 366 facilities and lines – 258 in operation and 108 planned for the future.