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CIS packagers enjoy stable demand for high-end auto applications

Julian Ho, Taipei; Willis Ke, DIGITIMES Asia 0

Credit: DIGITIMES

BGA (ball grid array) packaging demand for high-pixel and large-size automotive CMOS image sensor (CIS) chips remains in high gear, but lower-end car-use CIS products processed with wafer-level chip scale package (WLCSP) technology are showing signs...

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