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Mon, Jun 5, 2023
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Former TSMC R&D executive joins Samsung

Julian Ho, Taipei; Rodney Chan, DIGITIMES Asia 0

Credit: DIGITIMES

Lin Jun-cheng, who previously worked in TSMC's advanced packaging and testing department, has been appointed as Samsung Electronics' VP of advanced packaging business, raising concerns that the appointment may pose a threat to TSMC in the advanced packaging...

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