Disco set to increase production capacity by 40% to meet wafer equipment demand

Chiang, Jen-Chieh, Taipei; Jack Wu, DIGITIMES Asia Wednesday 18 January 2023 0

Credit: Disco

Japanese semiconductor equipment maker Disco has decided to increase the production capacity of its cutting and polishing equipment for wafers and electronic components. To do so, it will build a new plant in Nagano, Japan with an investment of around...

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