Cutting DDI production orders not an easy deal: Q&A with Chipbond Technology chair Fei-Jain Wu

Julian Ho, Hsinchu; Willis Ke, DIGITIMES Asia 0

Fei-Jain Wu, Chipbond Technology chairman; Credit: DIGITIMES

Taiwan-based Chipbond Technology, now holding the world's largest backend capacity for panel display driver ICs (DDI), continues to deepen cooperation with local OSAT Orient Semiconductor Electronics (OSE) and foundry United Microelectronics (UMC) to...

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