中文網
Taipei
Thu, Jun 30, 2022
20:42
mostly clear
28°C
CONNECT WITH US

Saultech Technology steps into CIS packaging/testing equipment

Siu Han, Taipei; Adam Hwang, DIGITIMES 0

Credit: DIGITIMES

Chip sorting and die bonding equipment developer Saultech Technology has begun development of CIS (CMOS image sensor) packaging/testing equipment, according to industry sources.

The premium content you are trying to open requires News database subscription. Please sign in if you wish to continue.
Companies
Related stories