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Wire-bonding to be increasingly needed to process car-use IGBT, SiC modules, says K&S VP
Julian Ho, Taipei; Willis Ke, DIGITIMES 0

Chan Pin Chong, VP at K&S. Credit: DIGITIMES

As the relatively mature wire-bonding technology continues to advance, it has become fully suitable for processing automotive silicon-based IGBT modules, and SiC (silicon carbide) power modules and is poised to embrace a surge in backend demand for...

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